The development of SACM™ lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock performance of low-Ag SAC (SnAgCu) alloys. We learned that the addition of Mn to create SACM™ also helps to improve the thermal cycling performance through refining the grain structure and slowing the intermetallic growth during aging.
The thermal cycling performance of SACM™ is superior to SAC305 after aging (see graph).
To learn all of the performance attributes of SACM™, visit www.indium.com/SACM.
*This post is part of the Introducing SACM™ series.