Here’s another amazing image from Michael Riddle, using Cyber Technologies metrology equipment and software. The particular flux pictured here has quite a prominent edge bead, which is pronounced in this artistic rendering.
Here’s another amazing image from Michael Riddle, using Cyber Technologies metrology equipment and software. The particular flux pictured here has quite a prominent edge bead, which is pronounced in this artistic rendering.
Are you looking for information on semiconductor packaging materials? Send your request to jhisert@indium.com. It’s all fair game – released, experimental, or competitor materials. Flux characteristics, paste properties, application methods…
Inquire about any of the following topics:
Indium Corporation’s industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation’s Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
Two upcoming white papers (currently under development):
Recent hot semiconductor blog topics, including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indium’s blogs can be seen at www.indium.com/blogs
Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
Two upcoming white papers (currently under development):
Recent hot semiconductor blog topics, including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indiums blogs can be seen at www.indium.com/blogs
Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
ׂ Flux deposit measurement using non-contact metrology
7 Two upcoming white papers (currently under development):
ׂ Recent hot semiconductor blog topics, including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indiums blogs can be seen at www.indium.com/blogs
Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
·Flux deposit measurement using non-contact metrology
·Two upcoming white papers (currently under development):
Wafer Flux Spin-Coating Topography
Wafer-Level Flux Printing
·Recent hot semiconductor blog topics, including:
Semiconductor assembly materials
Future trends in first- and second-level assembly
Halogen-free semiconductor assembly materials
Engineered solders in MEMS assembly
Thermal interface issues
Solar device assembly
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indium's blogs can be seen at www.indium.com/blogs
Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
נ Flux deposit measurement using non-contact metrology
נ Two upcoming white papers (currently under development):
נ Recent hot semiconductor blog topics, including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indiums blogs can be seen at www.indium.com/blogs
Indium Bloggers
Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
· Flux deposit measurement using non-contact metrology
· Two upcoming white papers (currently under development):
· Recent hot semiconductor blog topics, including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indium's blogs can be seen at www.indium.com/blogs
Pic: Rick Short with the Indium Corp.
Indium Corporation offers 9 blogs from 12 bloggers.
Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.
The technology experts will lead discussions on topics including:
Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.
All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!
Indium's blogs can be seen at www.indium.com/blogs
Writing an article is the hardest part of writing an article. It must have been said before, but actually sitting down and capturing what has been physically done and mentally learned is tougher for most people than doing all the testing. I like to clear away all the other distractions, get a humungous soda, and after thinking about the results all day – just write down all my thoughts. First I go through the introduction and test procedure, then include what I learned from the trials. After the words are in place, I look for a way to illustrate my point through images, graphs, and charts. I'll try to get away from the document at this point and clear my mind. When I come back to writing, the conclusion is usually obvious.
After the skeleton draft is in place I leave it for about a week, and then come back to it and look at it like it is someone else's article. I fill in the blanks, take out the redundant statements, and send it off for further editing. Right now I'm in the meditation and 'humungous soda' stage, preparing to draw up an article on non-contact measurement and wafer spin coating fluxes.
Profile of a wafer with flux applied.
Last week, Michael Riddle (Cyber Technologies) and I experimented with liquid fluxes for spin coating / wafer bump reformation. We used a Cyberscan Vantage to examine the topography of the flux at different spin rates and times. The interesting findings will be explained in our upcoming article (placement to be determined).
I just wanted to take a second and mention my affection for water soluble fluxes they make my life easier! ւIf youve ever used a spin coat machine (spinner) to apply a polymer or flux on a wafer, you know it makes quite a mess. The whole theory behind spin coating is to fling excess liquid off the wafer (and consequently onto the inside of the machine). Being able to simply use a water bottle and a wet paper towel to clean the machine is a lot more desirable to me than using a solvent like alcohol. Who wants to smell IPA?
Step 1, Liquid flux is deposited onto the center of the wafer
Step 2, A low rpm initial spin pulls flux from the center across the wafer surface
Step 3, A high rpm spin ejects excess flux - leaving a thin layer on the wafer
Spin coating is an amazingly simple way to apply flux to a (generally round) substrate. Most commonly used in wafer processing, spin coating can be used as a more uniform alternative to spraying liquid fluxes onto wafers for electroplated bump formation. Here is an image tutorial to introduce the process: