Spin Coating

Here’s another amazing image from Michael Riddle, using Cyber Technologies metrology equipment and software.  The particular flux pictured here has quite a prominent edge bead, which is pronounced in this artistic rendering.

• Are you looking for information on semiconductor packaging materials?  Send your request to jhisert@indium.com.  It’s all fair game – released, experimental, or competitor materials.  Flux characteristics, paste properties, application methods…

   

  Inquire about any of the following topics:

  • Pin transfer
  • Package-on-Package (PoP)
  • Solder spheres
  • Glass transition temperatures (Tg)
  • Flip chip assembly
  • BGA rework
  • Cross-sectioning electronic components
  • Paste for component dipping
  • Solder alloys
  • Liquid fluxes
  • Wafer bumping
  • Low alpha solder
  • Spin coating
  • Redistribution layers (rdl)
  • Halogen-free
  • Flux viscosity
  • Solder paste viscosity
  • Whatever else you are interested in

Indium Corporation’s industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation’s Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:

• Flux deposit measurement using non-contact metrology

Two upcoming white papers (currently under development):

• Wafer Flux Spin-Coating Topography
• Wafer-Level Flux Printing

Recent hot semiconductor blog topics, including:

• Semiconductor assembly materials
• Future trends in first- and second-level assembly
• Halogen-free semiconductor assembly materials
• Engineered solders in MEMS assembly
• Thermal interface issues
• Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indium’s blogs can be seen at www.indium.com/blogs

Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:

• Flux deposit measurement using non-contact metrology

Two upcoming white papers (currently under development):

• Wafer Flux Spin-Coating Topography
• Wafer-Level Flux Printing

Recent hot semiconductor blog topics, including:

• Semiconductor assembly materials
• Future trends in first- and second-level assembly
• Halogen-free semiconductor assembly materials
• Engineered solders in MEMS assembly
• Thermal interface issues
• Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indiums blogs can be seen at www.indium.com/blogs

Folks,

Indium Corporation's industry leading semiconductor bloggers are hosting a
Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's
Semicon West  exhibit, booth #7834,
from 2-3pm PST.

The technology experts will lead discussions on topics including:

*  Flux deposit measurement using non-contact metrology
*  Two upcoming white papers (currently under development):
*  Wafer Flux Spin-Coating Topography
*  Wafer-Level Flux Printing 

Recent hot semiconductor blog topics, including:

*    Semiconductor assembly materials
*    Future trends in first- and second-level assembly
*    Halogen-free semiconductor assembly materials
*    Engineered solders in MEMS assembly
*    Thermal interface issues
*    Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha , Fez Sayed, Dr.
Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks
will be served, too!

Indium's blogs can be seen at www.indium.com/blogs

Stop by and see them if you are at the show!

Cheers,
Dr. Ron

Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:  

ׂ Flux deposit measurement using non-contact metrology

7         Two upcoming white papers (currently under development):

• Wafer Flux Spin-Coating Topography
• Wafer-Level Flux Printing

ׂ Recent hot semiconductor blog topics, including:

• Semiconductor assembly materials
• Future trends in first- and second-level assembly
• Halogen-free semiconductor assembly materials
• Engineered solders in MEMS assembly
• Thermal interface issues
• Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indiums blogs can be seen at www.indium.com/blogs

Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:

·Flux deposit measurement using non-contact metrology
·Two upcoming white papers (currently under development):
Wafer Flux Spin-Coating Topography
Wafer-Level Flux Printing
·Recent hot semiconductor blog topics, including:
Semiconductor assembly materials
Future trends in first- and second-level assembly
Halogen-free semiconductor assembly materials
Engineered solders in MEMS assembly
Thermal interface issues
Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indium's blogs can be seen at www.indium.com/blogs

Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:

נ Flux deposit measurement using non-contact metrology

נ Two upcoming white papers (currently under development):

• Wafer Flux Spin-Coating Topography
• Wafer-Level Flux Printing

נ Recent hot semiconductor blog topics, including:

• Semiconductor assembly materials
• Future trends in first- and second-level assembly
• Halogen-free semiconductor assembly materials
• Engineered solders in MEMS assembly
• Thermal interface issues
• Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indiums blogs can be seen at www.indium.com/blogs

Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:  

·         Flux deposit measurement using non-contact metrology

·         Two upcoming white papers (currently under development):

• Wafer Flux Spin-Coating Topography
• Wafer-Level Flux Printing  

·         Recent hot semiconductor blog topics, including:

• Semiconductor assembly materials
• Future trends in first- and second-level assembly
• Halogen-free semiconductor assembly materials
• Engineered solders in MEMS assembly
• Thermal interface issues
• Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short. 

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indium's blogs can be seen at www.indium.com/blogs


Pic: Rick Short with the Indium Corp.

Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from 2-3pm PST.

The technology experts will lead discussions on topics including:

• Flux deposit measurement using non-contact metrology
• Two upcoming white papers (currently under development):
  • Wafer Flux Spin-Coating Topography
  • Wafer-Level Flux Printing
• Recent hot semiconductor blog topics, including:
  • Semiconductor assembly materials
  • Future trends in first- and second-level assembly
  • Halogen-free semiconductor assembly materials
  • Engineered solders in MEMS assembly
  • Thermal interface issues
  • Solar device assembly

Indium personnel who will be discussing these topics include Jim Hisert, Paul Socha, Fez Sayed, Dr. Andy Mackie, and Rick Short.

All attendees are welcome to participate in, or observe, the session. Snacks will be served, too!

Indium's blogs can be seen at www.indium.com/blogs

Writing an article is the hardest part of writing an article.  It must have been said before, but actually sitting down and capturing what has been physically done and mentally learned is tougher for most people than doing all the testing.  I like to clear away all the other distractions, get a humungous soda, and after thinking about the results all day – just write down all my thoughts.  First I go through the introduction and test procedure, then include what I learned from the trials.  After the words are in place, I look for a way to illustrate my point through images, graphs, and charts.  I'll try to get away from the document at this point and clear my mind.  When I come back to writing, the conclusion is usually obvious.

 

After the skeleton draft is in place I leave it for about a week, and then come back to it and look at it like it is someone else's article.  I fill in the blanks, take out the redundant statements, and send it off for further editing.  Right now I'm in the meditation and 'humungous soda' stage, preparing to draw up an article on non-contact measurement and wafer spin coating fluxes.

Last week, Michael Riddle (Cyber Technologies) and I experimented with liquid fluxes for spin coating / wafer bump reformation.  We used a Cyberscan Vantage to examine the topography of the flux at different spin rates and times.  The interesting findings will be explained in our upcoming article (placement to be determined).

I just wanted to take a second and mention my affection for water soluble fluxes they make my life easier! ւIf youve ever used a spin coat machine (spinner) to apply a polymer or flux on a wafer, you know it makes quite a mess.  The whole theory behind spin coating is to fling excess liquid off the wafer (and consequently onto the inside of the machine).  Being able to simply use a water bottle and a wet paper towel to clean the machine is a lot more desirable to me than using a solvent like alcohol.  Who wants to smell IPA? 

 

Spin coating is an amazingly simple way to apply flux to a (generally round) substrate.  Most commonly used in wafer processing, spin coating can be used as a more uniform alternative to spraying liquid fluxes onto wafers for electroplated bump formation.  Here is an image tutorial to introduce the process: