Power amplifiers and transistors come in many shapes and sizes. The performance requirements vary as well. Attaching them can be a critical aspect of your design.
Both Pb and Pb-free alloys can be manufactured as a solder preform with a flux coating.(Learn more) Selecting the right alloy and flux coating can be crucial to meeting your void criteria.
A high-tech SOLDERING solution might include NanoFoil®, which effects a solder joint while minimizing heat exposure to your components.
There are also thermal interface materials such as the HEAT-SPRING® which utilize the unique properties of indium to create a superior thermal connection, similar to a solder joint.
There are many different attachment methods available, contact me with your design parameters and we can find your solution.
Posted by on Thursday, May 12, 2011
From One Engineer to Another®
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Great thanks for sharing the cutting-edge attachment methods!
At our company we'd like to try to mount a Thermo-Electric Converter to the base plate using your Nanofoil. The key advantages are flux-free and epoxy-free technology that doesn't demand bulk heating-cooling cycle.
It's a kind of experimental work, so we don't need much of foil. Just to try.
Could you please be so kind as to recommend the best way to obtain the samples? There is Indium distributor in Lithuania, but for the first time I prefer direct contact.
Thanks for your time.
Best regards,
Ivan