Indium Corporation®

Indium Corporation Blogs

  • People
    • Technical Support Engineers
    • Sales
    • Human Resources
      • Jobs
      • Community Support
    • Marketing Communications
      • Trade Shows
      • Company News
      • Corporate Awards
      • Technical Milestones
      • Social Media
    • Employee Biographies
    • Corporate
      • About Us
      • Social Responsibility
      • Company News
      • Corporate Awards
      • ISO and ITAR
      • Trade Shows
      • Corporate Literature
    • Bloggers
    • Social Media
    • Facilities
    • Contact Us
  • Products
    • Flux and Epoxy
      • Ball-Attach Flux
      • Epoxy Flux
      • Flip-Chip Flux
      • Flux Pens
      • Flux-Cored Wire
      • Industrial Flux
      • Liquid Tabbing Flux
      • Package-on-Package Flux
      • Tacky Flux
      • TCB and Copper PIllar Flux
      • Wave Flux
      • Wafer Bumping Flux
    • Inorganic Compounds
      • Featured Products
      • Indium Compounds
      • Gallium Compounds
      • Germanium Compounds
    • Metals
      • Indium
      • Gallium
      • Tin
      • Germanium
      • Reclaim and Recycle
    • NanoFoil®
      • Sheets
      • Preforms
      • Powders and Particles
      • Sputtering Target Bonding
    • Reclaim and Recycle
      • Solder and Solder Dross Recycle Program
    • Solar Assembly Materials
      • Metallization Paste
      • SUNTAB™ PV Ribbon
      • Liquid Tabbing Flux
      • Solders
    • Solder Paste and Powders
      • SACM™
      • Indium8.9 Series
      • Lead-Free
      • Tin-Lead
      • Package-on-Package Paste
      • Low Temp/High Temp
      • Die-Attach
      • Wafer Bumping Paste
      • Solder Fortification®
      • Gold-Based Solder Paste
    • Solders
      • Bismuth Solders
      • Gold Solders
      • Indium Solders
      • Bar Solder
      • Low Temp/High Temp
      • Preforms
      • Ribbon and Foil
      • Solder Fortification®
      • Spheres
      • Tape and Reel Packaging
      • Solder Paste and Powders
      • Wire
      • Alloy Chart
    • Thermal Interface Materials
      • Heat-Spring®
      • NanoFoil®
      • Preforms
      • Ribbon and Foil
      • Other
      • Solder TIM
    • Thin-Film Materials
      • Featured Products
      • Sputtering Targets
      • Indium
      • Gallium
      • Others
  • Applications
    • Compounds
      • Batteries
      • Catalysts
      • Fiber Optics
      • LED MOCVD Precursors
      • Optical Lens
      • Reclaim and Recovery
    • Engineered Solder and Alloys
      • Connector Assembly
      • Cryogenic Seals
      • Die-Attach
      • Hermetic Sealing and Pass Throughs
      • IGBT
      • Medical Devices and Electronics
      • Thermal Management
    • LED
    • Low Temperature Alloys
    • Medical Devices and Electronics
    • PCB Assembly
      • Package-on-Package
      • Rework and Touch-Up
      • Solder Fortification®
      • Surface Mount
      • Thermal Management
      • Wave Solder
    • Semiconductor and Advanced Assembly
      • 2.5 and 3D Packages
      • Ball-Attach
      • Die-Attach
      • Flip-Chip
      • Package-on-Package
      • Pb-Free Including High Temperature Pb-Free
      • Shock Resistance Solutions
      • SnPb Including High Temperature High Pb
    • Thermal Management
      • Burn-in and Test
      • Concentrated Photovoltaic
      • IGBT
      • RF Power Devices
      • TIM1, TIM1.5, TIM2
    • Thin-Film
      • Thermal Evaporation
      • Plating
      • PV Sputtering Targets
      • Target Bonding
      • PVD Coating Materials
  • Contact Us

Home Page

Return to Blog Summary Page ↑

The Magic of Engineered Solders

Posted by Seth Homer on Friday, April 5, 2013

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless.

One of my personal favorite engineered solders is Solder Fortification® Preforms. Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. Solder Fortification® Preforms are the solution for many challenging manufacturing issues from miniaturization to tightly fitted components to achieving just the right amount of solder in just the right place.

Solder Fortification® Preforms are generally rectangular pieces of alloyed metal that do not contain any flux. The preform is added to a deposit of solder paste using standard pick and place equipment. Since the alloy for both the preform and the solder paste is the same, the preform will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. The preform increases the volume of solder over what could be achieved with solder paste alone, especially for stencils with a pitch of 0.3mm or less.

Tell me where engineered solders, especially Solder Fortification® Preforms, might help you. I'll take it from there.

Seth

Leave a Comment »

Void Reduction in Solder Joints

Posted by Seth Homer on Friday, January 13, 2012

Solder Void Mechanisms

It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is the failure mechanism.

In many cases voiding can be traced back to residual flux left in the joint. Optimizing the flux content and strength, coupled with reflow profile adjustments, can reduce voiding drastically. Other causes of voiding can be oxidation of the solder and or surface metallizations. Usually a stronger flux or improved storage conditions can help alleviate this issue. Alloy choice can also be a factor.

The variables can be many. Defining the root cause and developing an approach to reduce voiding can be daunting. This paper might offer some guidance:  Voiding Mechanisms in SMT

IF your application is more specific, and further assistance is needed, feel free to contact your regional application engineer.
Click here: TECH SUPPORT DIRECTORY

Or contact me. I'd love to discuss your project.

Seth

Leave a Comment »

Practical Suggestions for Solder Preform Design and Implementation

Posted by Seth Homer on Friday, January 13, 2012

Solder Preform Design PathHave you ever found yourself knowing where you want to go, but not sure how to get there?

This can be frustrating and time consuming if not impossible without a map. It can be the same when introducing a solder preform into your process. You know what you hope to achieve by adding a preform, but where do you start to design it?  Whether you’re thinking of designing a solder preform into your build, or using one to replace solder paste, the approach is generally the same.

·         The solder volume should be sufficient to meet the desired reliability and performance criteria.

·         The geometric constraint is normally derived by the component being soldered and the desired bond line thickness

·         The soldering temperature of the alloy should not be high enough to damage components, but robust enough to withstand the device's max operating temperature.

·          If step soldering, then the melting temperature of the alloy needs to fall into the reflow hierarchy you have designed for your process.

·         Surface metallization should be compatible with the solder used to make the joint.

Although this is a simplified list, it does offer a starting point.  For more information follow this link,  Practical suggestions for solder preform design

If this doesn’t get you there, feel free to contact me directly 315-853-4900 ext. 2106
Seth

Leave a Comment »

Options for Attaching Power Amplifiers: Soldering & Thermal Management

Posted by Seth Homer on Thursday, May 12, 2011

Power amplifiers and transistors come in many shapes and sizes. The performance requirements vary as well. Attaching them can be a critical aspect of your design.

TIM DATABoth Pb and Pb-free alloys can be manufactured as a solder preform with a flux coating.(Learn more)  Selecting the right alloy and flux coating can be crucial to meeting your void criteria.  

A high-tech SOLDERING solution might include NanoFoil®, which effects a solder joint while minimizing heat exposure to your components.

There are also thermal interface materials such as the HEAT-SPRING® which utilize the unique properties of indium to create a superior thermal connection, similar to a solder joint.

There are many different attachment methods available, contact me with your design parameters and we can find your solution.  

Leave a Comment »

Temperature Driven Applications for Fusible Alloys

Posted by Seth Homer on Thursday, September 24, 2009

Considering a fusible alloy as a solution really starts with the applications temperature profile. When cooking a turkey (pop-up timer) or supressing a fire (sprinkler systems), its all about the heat and what the fusible alloy does in response to it.  Reliability is achieved through ensuring that each alloy is homogenious and not subjected to segregation. Take a look at our list of alloys, and you'll find that there are many options to choose from, many of which are Bismuth containing. These can be manufactured in many shapes and sizes and due to the high volume nature of these applications, the need for tape and reel is almost a given.
 

fusible alloy solder prefrom tape and reel


 

Leave a Comment »

Making Bismuth Solder Less Brittle

Posted by Seth Homer on Thursday, September 3, 2009

The binary eutectic alloy of bismuth and tin (Bi/Sn) is well suited for many low temperature applications due to its melting point of 138°C, but the alloy is known for being rather brittle for a solder alloy.
All hope is not lost though - there is a similar alloy, known as Indalloy 282, which drastically reduces the brittle nature of the Bi/Sn alloy with the addition of just 1% Silver (Ag).  This 57%Bi/42%Sn/1%Ag alloy has a 1°C higher melting point.  Although you won’t be able to notice this reflow change, you will immediately notice the physical difference if you compare solder wire made from each alloy.  The Bi/Sn wire is likely to break upon bending, unlike the Bi/Sn/Ag alloy.
The easiest (and most economical) way to experiment with these alloys is with a solder wire kit . With a wire kit you can obtain both wires in the same diameter, and you get 5 fluxes to help with soldering.  You can also get up to 10 different alloys if you want to experiment-your-heart-out and compare Bi/Sn and Bi/Sn/Ag to other alloys like Sn/Pb or Sn/Ag/Cu.

Leave a Comment »

Surface Preparation for Flux-less Reflow – The Solution

Posted by Seth Homer on Thursday, February 26, 2009

I can't promise that every gold-indium or copper-indium soldering process can work without a flux, but there are tricks to give you a better chance of obtaining the flux-less thermal assembly that eludes so many thermal engineers. The indium itself won't build up a thick layer of oxides (see Amanda Hartnett's blog "Indium Oxide Layer"), so the problem is generally the substrate oxides.

Some people have used an emery cloth followed by an alcohol rinse for Cu oxide removal, which should work.  The surface preparation that is used in labs is different though.  I prefer to use 15% - 20% Nitric Acid or 5% - 15% Sulfuric Acid to clean copper for 2 – 5 minutes.  Other acids are also used – it is just important that the acid is strong enough to remove the oxides, and can be fully cleaned after etching is complete.

While the acid etch process can be used to remove initial oxides, it does nothing to protect the surface from oxygen attack during reflow.  This requires flux or forming gas.  The reducing chemical reaction between hydrogen based forming gas and oxides starts to occur at or above 275degC.  Below that temperature, the gas works as an inert atmosphere.  The Au and Cu parts may be cleaned very well by exposing them to this gas at a high temperature, and introducing clean indium at a lower temperature (using the gas as an inert atmosphere).  Superheating the indium to +275degC is not advised though, since excess intermetallics may result. 

The hydrogen will not be a true reducing atmosphere at typical indium reflow temperatures.  Although the forming gas does nothing for indium, it will at least be of use with the Au and Cu metallizations.  The inert properties of the gas will definitely help protect the assembly from oxygen at soldering temperatures.

Leave a Comment »

The Reel Challenge

Posted by Seth Homer on Wednesday, January 14, 2009
Tape and Reel

Tape and Reel

Tape and Reel has been on my mind a lot lately. Staying on top of this preform packaging trend is important.

Whether we're looking for the right size pocket, cover tape, or even the orientation of the part, the name of the game is always performance. If the peel force isn't within a tight spec or the pocket is too large, then a drop in pick performance is imminent. Everyday there is a new challenge and new part someone wants placed in tape. Just when we think we've seen it all, a customer will come to us for help on something new.

Were always looking for new challenges, so feel free to contact me with yours.  

Leave a Comment »

Flux coated preforms are like a snowball….

Posted by Seth Homer on Tuesday, April 1, 2008

For those of us who grew up in colder climates, snowball fights were a right of passage. As a child I fell victim to the misconception that a really big snowball would hasten the victory I desired. I realized quickly that too much snow was hard to throw and basically useless. Needless to say I was pummeled into oblivion by my adversaries. It didn't take long for me to realize that there had to be "just enough" for optimal performance. When it comes to flux coating your engineered solder preform, the same rules apply.
When a flux is required to facilitate a bond in an engineered solder application, the flux type depends on the alloys involved, the temperature range and the surface you're dealing with. Herbert Ludowieg is one of our manufacturing engineers involved with engineered solders and flux coated preforms, he has this advice;
"Since most surfaces involved are in good shape, starting with a low percentage of flux is best. Larger quantities can result in excessive cleanup after reflow and can change the dimensions on through holes by reducing the size of an opening. Ultimately, more is not always better. We have several customers who have reduced their flux percentage from more than 2% to 0.5% with excellent results, the parts are easier to handle and have a better overall experience."
These issues along with possible voiding can really make your flux coated preform experience a bad one. For further support and information, please use the following links:(Flux Coatings for Preforms) and (World Class Tech Support)
Leave a Comment »

“There’s an ‘L’ in solder?”

Posted by Seth Homer on Friday, February 22, 2008

This question was posed to me while introducing a family member to the world of Engineered Solders this past weekend. While I was still reeling from the shock of what seemed like a ridiculous question, it suddenly occurred to me that solder is not part of everyone's daily life. Actually it is, they just don't know it. Take a moment to run through the average day. Before you get through the morning you have probably taken solder for granted more often than you realize.
Usually the day begins with the dreaded alarm clock we all wake up to (Solder Paste) and the flat screen HDTV we watch the morning news on(Thermal Products). Need I mention the cell phone (Engineered Solders)?

Indium has over 200 alloys to choose from.(Alloy List) The list is always growing, but the diversity in solder types is exceeded only by the applications in the industry.
With close to 75 years of contribution to the ever changing world of solder, Indium has been a leader in technology and education. Right down to the correct spelling of the word.

Leave a Comment »

From One Engineer to Another®

Indium Corporation — ©1996–2013. All Rights Reserved.

Powered by Compendium

Contact Seth Homer

+1.315.853.4900

shomer@indium.com

Read Seth Homer’s Blog

View Seth Homer’s Bio

Subscribe

Feed

Email

Translations

  • German
  • Spanish
  • French
  • Korean
  • Chinese (Simplified)
  • Chinese (Traditional)

Categories

  • Alloys Solder
  • Antimony Solder
  • AuSn
  • B2B Marcom
  • Ball Attach
  • Bar Flux
  • Bar Solder
  • Bar Wave
  • BGA
  • BGA Process
  • Bismuth
  • Bismuth Alloys
  • Bismuth Tin Alloy
  • Bonding Ribbon
  • BtoB Marcom
  • Burn In
  • Bus Ribbon
  • Chip Attach
  • CIG
  • Clad Preforms
  • Connected Preform
  • Copper Indium Gallium
  • Cored Solder
  • Cored Solder Wire
  • Cored Wire Solder
  • Die Attach
  • Dipping Flux
  • Dipping Paste
  • Epoxy Flux
  • Flux
  • Flux Cleaning
  • Flux Cored Solder
  • Flux in Soldering
  • Flux Pen
  • Fusible Alloy
  • Gallium Alloy
  • Gold Indium
  • Gold Tin
  • Graping
  • Halogen Free
  • Hand Soldering
  • Head In Pillow
  • Heat Spring
  • Hermetic Sealing
  • Indalloy
  • Indium
  • Indium Alloy
  • INDIUM CORPORATION
  • Indium Tin Oxide
  • Indium Wire
  • Intermetallic
  • Lead Free Assembly
  • Lead Free Paste
  • Lead Free Profile
  • Lead Free Silver Solder
  • Lead Free Solder Flux
  • Lead Free Solder Paste
  • Lead Free Solder Temperature
  • Lead Free Soldering
  • Lead Free Wave Soldering
  • Leadfree Solder
  • Led Solder
  • Liquid Flux
  • Low Alpha
  • Marketing Communications
  • Metallization Paste
  • NanoBond
  • NanoFoil
  • Nanotechnology
  • No Clean Flux
  • No Clean Solder
  • No Clean Solder Paste
  • No Lead Solder
  • Package On Package
  • Paste Flux
  • Paste Soldering
  • Pb Free
  • PB Free Solder
  • Phase Change Material
  • Pin Transfer
  • Pop Flux
  • Pop Solder Paste
  • Preform Manufacturer
  • Preform Price
  • Reflow Solder
  • Rework
  • Rework Flux
  • Ribbon Solder
  • RMA Flux
  • RoHS
  • SAC Solder
  • SAC305
  • SAC305 Solder
  • SACX0307
  • Semiconductor Packaging
  • Silver Lead Free Solder
  • Silver Solder Paste
  • Silver Tin Alloy
  • SMT Solder
  • SMT Solder Paste
  • SOLAR
  • Solder
  • Solder Alloy
  • Solder and Flux
  • Solder Bar
  • Solder Basics
  • Solder Bumping
  • Solder Cream
  • Solder Defect
  • Solder Evaluation
  • Solder Joints
  • Solder Melting
  • Solder Metal
  • Solder Paste
  • Solder Paste Reflow
  • Solder Paste Syringe
  • Solder Preform
  • Solder Price
  • Solder Process
  • Solder Quality
  • Solder Reliability
  • Solder Sphere
  • Solder Stencil
  • Solder Suppliers
  • Solder Tin Lead
  • Solder Wires
  • Solder With Flux
  • Solderability
  • Soldering Assembly
  • Soldering Flux Paste
  • Soldering Fluxes
  • Soldering Lead Free Solder
  • Soldering Materials
  • Soldering Paste
  • Soldering Products
  • Spin Coating
  • Sputtering Target
  • Tabbing Ribbon
  • Tape And Reel
  • Thermal Interface Material
  • Thermal Management
  • Thin Film Technology
  • Tin and Lead Alloy
  • Tin Antimony Solder
  • Tin Gold Solder
  • Tin Lead Alloy
  • Tin Lead Phase Diagram
  • Tin Silver Solder
  • Tombstoning
  • Wave Solder
« View All Categories »

Recent Entries

NanoBond® is a Fluxless Process
by Jim Hisert on May 16
The Right Climate Stuff Research Team Hits the Mark
by Dr. Ron Lasky on May 14
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
by Jim Hisert on May 14
Interesting Indium and Gallium Video
by Jim Hisert on May 9
Eliminating the Bond Stress of Sputtering Targets at Operating Temperatures
by Jim Hisert on May 7
Material Safety Data Sheets
Product Data Sheets
ISO and ITAR
Online Store
Tech Team

Connect with Indium

  • LinkedIn
  • Facebook
  • Twitter
  • YouTube
  • Blogger

+ Read our latest posts!

Americas

Utica, Chicago, Clinton
E-Mail: askus@indium.com
Phone: +1 315 853 4900

Asia/Pacific

Singapore, Cheongju
E-Mail: asiapac@indium.com
Phone: +65 6268 8678

China (中国网站)

Suzhou, Shenzhen, Liuzhou
E-Mail: china@indium.com
Phone: +86 (0)512 628 34900

Europe

Milton Keynes, Torino
E-Mail: europe@indium.com
Phone: +44 (0)1908 580400

Regional/Local Sales Support
Technical Service & Support

  • Home
  • Online Store
  • ISO and ITAR
  • Corporate
  • Tech Documents
  • MSDS
  • About Us
  • Jobs