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Has Lead-Free RoHS Compliant Assembly Reliability and Cost "Arrived?"

Posted by Dr. Ron Lasky on Monday, February 25, 2013

Folks,

I was at APEX 2013 San Diego this past week.  San Diego is a great venue for the show, but I always forget how cold it can be (55-65°F) this time of year.  The folks at iConnect 007 interviewed me at the show; the topic was lead-free reliability and has cost for consumer electronics been demonstrated.  You can see the interview here.

These are topics I think about often, so let’s discuss them a bit. First, let’s consider reliability.  RoHS was enacted on 01 July 2006, more than 6 ½ years ago.  Each year more than $1 trillion-worth of electronics are made, therefore, in this period of time, something over $3 trillion worth of consumer electronics have been manufactured.  There have been no “the sky is falling”-type of reliability issues in this time.  How can I say this?  Well, my office at the Thayer School of Engineering at Dartmouth is across the hall from the IT (information Technology) Dept.  They purchase all of the millions of dollars worth of PCs, printers, displays etc. that Thayer uses.  Several years ago (say early 2011) I stopped by when most of the department was in and cheerfully asked if the reliability of the equipment they purchase has gone down since lead-free assembly was enacted.  They asked me in unison, “What’s lead-free assembly.”  After I explained what lead-free assembly was, they confirmed that they have noticed no changes in reliability.  Since RoHS, my family has purchase about 100+ electronic devices, a few have had reliability problems, about as many as in the past.  Most were attributed to hard drive fails.  Of the scores of friends and colleagues I have, no one has ever commented that they have noticed an increase in electronics fails. So, my conclusion is that consumer product reliability is not "practically" worse if my family and  these many  other folks haven’t noticed it.

I have made an informal study of reliability data of lead-free vis-a-vis tin-lead solders published in papers.  A statement from Rockwell Collin’s JCAA/JGF-PP No Lead solder Project: -55C-125C Thermal Cycle Testing Final Report  sums up my overview conclusion nicely: “Test vehicles assembled with lead-free materials (notably tin-silver-copper) exhibited lower reliability under some test conditions.”  Nay sayers might be quick to suggest that this statement  says that lead-free is no good.  However, the statement could be reworded to say: “In considerably more than half of the test conditions, test vehicles assembled with lead-free materials had higher reliability." Counting the comparisons in the Rockwell Collins paper shows lead-free better in 51 cases, tin-lead better in 31 cases, and one draw.  However, it is disturbing that a small percentage of lead-free assembled test vehicles had much much worse reliability than tin-lead test vehicles.  This later information makes me believe that lead-free is not yet ready for mission-critical, high-reliability, long-life products.  These small numbers of much poorer reliability assemblies must be understood and corrected before lead-free is ready for mission-critical prime time.  The much shorter life cycle of today’s consumer electronics may also mask this concern.

What about cost?  I don’t at all want to minimize the expense that many went through to go lead-free and RoHS compliant.  In about 2007, one of our colleagues estimated that it cost the electronics industry $20 billion to become RoHS compliant.  I think this number is low, but, from a consumer’s perspective, there has been no cost hardship.  The price of a PC continued to go down during and after RoHS implementation, as shown in the figure below.  While performing my non-scientific survey of co-workers, family, and friends on reliability, I also asked about cost.  All agreed, electronics are cheaper than ever.

Challenges still exist, even in consumer electronics with the Head-in-Pillow, Graping, non wet opens, and other defects.  However, we can all purchase lead-free, RoHS compliant products at a reasonable cost and reliability.

 

Cheers,

Dr. Ron

The source for the image is :http://thomaslah.wordpress.com/2010/02/03/apple-and-intel-defying-gravity/

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Where is Tin Silver Solder, Now That You Need It?

Posted by Carol Gowans on Friday, November 16, 2012

Over the years, solder alloy choices have been pretty stable.  In the last century, SN63 and SN62 could be found at any company making any kind of electronic device, and both alloys were the backbone of every company making solders.

But, when lead was identified as causing health issues, it was legislated out of everything from paint to gasoline to electronics, including solders.  In 2003, RoHS (Restriction of Hazardous Substances) was passed in Europe to restrict the use of lead (as well as mercury, cadmium, hexavalent chromium, and polybrominated diphenyl ethers: PBDE) in electronics and electronic equipment.

The electronics industry is now focused on SAC alloys (so named because they contain Sn, Ag, and Cu).  But, there is also SnAg, which was used in the lead era when a higher melting point was required.  The addition of the copper (in SAC) offers the benefit of improving wetting and potentially reducing the silver content from a non-copper alloy like 96.5Sn 3.5Ag. 

But, there are many applications where SnAg works well. Changing from it would require customer and/or government approval, and that involves a lot of extra money and time. This lead-free alloy works well in the assembly of a variety of medical devices that use non-traditional metallizations and fluxes.  The Cu addition (in a SAC alloy) probably would not improve the results enough to warrant the cost of requalifying an existing medical device through government agencies, so they stay with what works. 

So, if you are using 96.5Sn 3.5Ag (or 96Sn 4Ag), don't be afraid to stick with it.  Indium Corporation offers both of these solder alloys (and over 250 other alloys) in a variety of forms: preforms, wire, paste, and ribbon.   And, if you want to look at the SAC alloy family to see if it works better in your application, we will help you with that, too.  Just contact our Application Engineering Staff for help.

Carol

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India WEEE/RoHS Is Here! Compliments Of The Government of India, Ministry of Environment & Forests

Posted by Liyakathali Koorithodi on Tuesday, May 29, 2012

Indian electronics manufacturers and solder users. This info is for you.

After many years of discussion and policy making, the Indian Government rolled out its WEEE/RoHS directive, effective 01 May 2012. This directive is known as e-waste (Management and Handling) Rules 2011 thru the vide number S.O No. 1035 (E) by The Government of India, Ministry of Environment & Forests. (for Hindi version click here).

This directive has 6 chapters covering electrical and electronics waste handling, responsibilities, recycling, etc. It also restricts the usage of certain hazardous substances in electrical and electronics equipment. This section is very similar to the European Union’s RoHS directive; but there is a two year time period to achieve this. So the India RoHS will be in force starting 01.May.2014 (this date applicable only to restriction of using hazardous substance mentioned in e-waste rule, 2011).

As with other RoHS directives, the Indian e-waste rules 2011 also come with an exemption list.

This directive compels consumers (including government departments) to strictly follow the ‘e-waste rule’ during their purchase and usage of electrical electronics equipment.

While industry has yet to discuss this rule in particular, the European Union’s WEEE/RoHS has been driving the Indian electronics industry for the last few years - and most of the manufacturers are complying with RoHS. This will have a big impact on local electronics manufacturers and governmental companies. From a lead-free solder alloy perspective, there will be big impact on knowledge transfer, training, and so on for local manufactures.

There are still many questions, like how this will be implemented, who will be responsible, how this will be rolled out to stakeholders, and more.

Indium Corporation would like to know what you think about this. We are happy to help customers and governmental agencies roll out this directive by providing technical information and other knowledge - sharing our support.

Please feel free to contact me with questions.

Liya

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Weigh In on the Lead-Free Soldering Consensus Topics

Posted by Dr. Ron Lasky on Friday, October 7, 2011

Pb FreeFolks,

Some time ago, I mentioned that I was working on a consensus of the status of lead-free/RoHS
compliant assembly. My hope is to find data and facts that will support the consensus. I am making progress, but at this time I would like to share the subtopics in the consensus. Look them over and see what you think:

1.       Was/Is lead-free electronics/RoHS needed to protect the environment?

2.      Is lead-free solder easier and safer to recycle than lead-containing solder?

3.      How has the increased use of tin and silver affected their supply and price?

4.      How much did it cost to implement lead-free/RoHS compliant electronics?

a.      What is the cost adder to a typical lead-free product?

5.      What are the process challenges of lead-free assembly?

a.      Are these challenges being addressed?

b.      If so, how?

6.        What is the reliability of lead-free vs leaded electronics for commercial applications?

a.      E.g. 0C to 100C thermal cycle, drop shock

7.        What is the reliability of lead-free vs leaded electronics for harsh environment/military applications?

a.      E.g. -55C to 125C thermal cycle, other Mil stress tests

8.      What is the threat of tin whiskers, tin pest and other similar lead-free related reliability phenomena?

9.      What is the status and need for halogen-free assembly?

 

Help me by suggesting topics that I have left out.     
Contact info here.
Cheers,
Dr. Ron

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Tin and Silver Use in Electronics after RoHS

Posted by Dr. Ron Lasky on Thursday, September 22, 2011

Folks,

In a recent posting we discussed that the higher melting temperatures of lead-free solder require reflow soldering temperatures to be higher, thus more electricity is used in lead-free assembly. However, as we calculated, this increased use of electricity is very small compared to all electricity used in the world.

An additional concern that some have voiced is the claim that RoHS, with its lead-free requirement, actually makes the environment worse because more tin and silver is used in lead-free solders.   They argue that the increased use of these metals, creates mining pollution and has driven the price of these metals sky high. Let’s examine these claims.

Figure 1 Tin UsePrismark has estimated that approximately 90,000 tons of solder are used in electronics, with about 80,000 used in wave soldering and 10,000 tons for SMT soldering. It is important to remember that electronics solder is a subset of all solder. All solder (alloys for brazing pipes etc) uses about 190,000 tons of tin. Solder is the single largest user of tin. See Figure 1. 

Figure 1. Solder is the largest end use of tin. Tin is the base material for almost all solders. 

If tin-lead solder were still used predominantly, approximately 57,000 tons of tin (90,000 x 63% tin) would be used annually. With lead-free solder, about 88,000 tons (90,000 x 98% tin) of tin are used per year. This is an apparent increase of about 30,000 MT of tin used each year. However, an interesting thing to consider is that lead-free solder is about 14% lighter than tin-lead solder. Knowing that, and knowing that solder used in wave soldering (remember wave soldering accounts for almost 90% of all solder used in electronics assembly) is consumed by volume not weight (i.e. assuming approximately the same fillet size), about half of this increase is canceled out. 


This is all a bit confusing however, so it may be best to just to look at tin use. According to the United States Geological Survey (USGS), about 300,000 tons of tin are mined each year. Figure 2 is a graph of world tin production at mines per year (this graph does not show recycled tin.)  The amount of refined tin used each year in the US is depicted in Figure 3. Figure 3 includes about 15,000 tons a year of recycled tin. Recycling solder is very cost effective. Scott Mazur just pointed out (Printed Circuit Design and Fab and Circuits Assembly, p 36, August 2011), that recycling solder dross is 10 times as cost effective as recycling aluminum cans.

Looking at these graphs, it is hard to say that the amount of tin used has gone up since RoHS. It would appear that tin use is likely more affected by the economy and that it is really difficult to see an effect from RoHS’s July 2006 enactment.


Figure 2. World Tin Production at Mines. 

Figure 2 Tin Mine ProductionMost wave soldering solders have low or no silver. So, about 3% of the 10,000 tons of SMT solder, or 300 MTs of silver, are used in electronics. This is about 1.5% of the 22,000 MTs of silver produced each year. Silver use in electronics does not make anyone’s list of top silver usage.















Figure 3. US consumption of tin has decreased since RoHS was enacted.

Figure 3 US Tin UseSo electronics solder use since RoHS has not caused tin use to increase, nor is it a significant factor in silver use. Therefore it is highly unlikely that electronics' use of tin or silver has been a prime driver in their stunning price increases in 2011.

Cheers,

Dr. Ron
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银锡焊接材料(SnAg Solders)

Posted by Anny Zhang on Monday, August 1, 2011

最近有一家供应商突然中断提供了银锡焊接材料,所以有些客户朋友们马上向Indium公司资讯。还好,Indium一直为大家提供银锡材料。

Sn96.5Ag3.5是221°C的共晶材料。这种银锡材料很早以前就被分层焊接(step soldering)和在汽车工业上使用(automotive industry ), 是最早的无铅材料之一。Dr. Ron Lasky的“Happy Birthday RoHS”博文中有更详细的介绍。

SnAg银锡合金有以下几种特点:

  • 高热传导性:High thermal conductivity (33W/mK)
  • 低的张应力( tensile stress ): 5800psi
  • 良好的热循环性能thermal cycling:-55 到125 0 C
SnAg 银锡合金的这些特点,使其还可以使用与IGBT的焊接,和医疗中人体使用的可移植性设备镍锑合金(nitinol)的焊接。

Cheers,

Acknowledge: Dr. Andy Mackie with Indium Corporation; Dr. Mackie's blog post "Tin/Silver Solder Paste in Die-Attach (Sn/Ag)"

Nitinol

Pic: Google Image

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Happy Birthday RoHS!

Posted by Dr. Ron Lasky on Monday, August 1, 2011

96.5%Sn 3.5%Ag Solder Paste: lead-free, mid-temperature Indium CoroprationFolks,

It was five years ago today that RoHS was launched, amid concerns that the world of electronics would collapse due to the many challenges of lead-free (Pb-free) soldering. Well, we have five years of field data with no “the sky is falling” lead-free reliability events. But, has it been just five years?

No. As I mentioned in a recent post, Motorola implemented lead-free soldering around 2001 to take advantage of lead-free solder’s poorer spreading.  Hmmmm,  so it has been ten years! Not too bad!

Well it is actually better than that. SnAg3.5 solder has been used for decades in both:

1.     Step soldering:  with a eutectic temperature of 221C, SnAg3.5 can be used as the step previous to soldering with Sn63 or similar Pb-Free solder. The principle is to solder first with the SnAg3.5 and then with a lower melting temperature solder. The second soldering step is performed at a lower temperature, therefore not disturbing the SnAg3.5 solder joint or bond. 

 

2.      Mid-Temp Pb-Free alloy:  when a solder that melts somewhat above the melting point of a “standard” solder alloy is needed, and it must be Pb-free, SnAg3.5 is often the choice.  The automotive industry has used SnAg3.5 in these applications for decades.

While I still agree that lead-free solders need some time and experience, especially in harsh environments, to establish acceptable reliability for mission critical applications, the experience with SnAg3.5 is adding to lead-free solder’s reliability portfolio.

This information came to light with the recent announcement by a major solder materials supplier that they would no longer supply SnAg3.5. But take heart, Indium Corporation still supplies SnAg3.5.  

Cheers,

Dr. Ron
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焊接材料使用在医疗器械上

Posted by Anny Zhang on Thursday, July 14, 2011

上来扫尘了!前段时间生了个大胖小子,所以从怀孕到破腹产,见识了很多美国先进的医疗器械,联系到平时销售工作中了解到的客户成品,有些感慨“原来成品长这个摸样, 是这样使用的”!幸运也好,或是有些“不幸”吧,成品用在了我身上。

在电子制造加工行业(Electronic Assembling Industry),亚洲很多工厂都是在做high volume, low mix 的产品,特别是computers, consumer devices & communication发面。 美国和西欧的工厂,更多是做high mix, low volume, 比如说医疗器械。

医疗器械的产品,直接涉及到生命安全,而且大部分都是long life span的,所以对可靠性(reliability)的要求十分高。 这也使很多加工医疗器械产品的工厂对焊接材料的选择和测试要求很严格,特别是对焊锡膏(solder paste)。

大件的没有和人体直接接触的医疗器械板子,很多都还是在用有铅SnPb焊接材料,比如说我这次生产前使用的超声波测试仪,监视宝宝心跳和我宫缩的测试仪,都应该还是有铅板子。不过很多医疗器械的客户们都在密切关注着2014年RoHS2对这方面的要求;客户们也在密切做准备,评估无铅材料,来应对届时的变化需求。

和人体有直接接触的医疗器械,很多都已经是无铅了。 前段时间有个客户生产一种一次性心跳读数器heart rate reading device,板子的形状像一个很小的婴儿鞋子,只有成人手掌的1/4大小左右,而且十分薄。当时就使用了我们的SAC305 焊锡膏和solder preforms (预成型焊片)。据说这种携带型小仪器可以扣在衣服上读病人的心跳,读出的数据直接通过wi-fi传送到医院的数据中心进入系统;医生和医院就可以随时随地远程收集病人的数据……

世界人口在不断地增多,也在不断地老龄化(aging population),这使对医疗器械的需要在增加。这应该是一个有前景的大行业,也希望大家都能享受到这些科技进步带来的便利,益寿连年。

Cheers!

Read Baby's Heart Rate

Pic: Google Image

PS: 还是那句我喜欢的话“生命在于运动(一下)”。和身边很多孕妇朋友相比,我才发现原来自己从小坚持和热爱运动在怀孕和生产过程中帮了那么大忙,生之前那一天我妈妈还在感慨说我走路一小时都还是健步如飞的,哈哈:-)

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Field Data Encouraging for Lead-Free Solder Reliability

Posted by Dr. Ron Lasky on Monday, June 27, 2011
 

Folks,

Although a few have suggested that lead-free reliability is an oxymoron, currently most people that have studied the reliability of SAC3XX and SAC105 Pb-free solders would conclude something akin to what Denny Fritz wrote
in response to one of my posts:

“No one I know will dispute your ranking of SAC better than SnPb solder using the commercial temperature cycle Henshall uses – 0C to 100C. But, harsh environment electronics have to perform to either -40C or -55C, and most use a top end cycling temperature of 125C. IT IS IN THAT WIDE THERMAL CYCLE TESTING THAT SnPb outperforms SAC solders.”

It is interesting to consider however, that almost all discussions on lead-free solder reliability are based on lab-based thermal cycling and drop shock testing. What about field results? It occurred to me that I knew someone who might have an answer.

Droid x2Vahid Goudarzi is a Director of NPI Advanced Manufacturing Technology at  and owns a Six Sigma Black Belt.  He was the technical leader in Motorola’s efforts for lead-free and RoHS compliant assembly in their mobile phone products. There are few people I know that are more knowledgeable in electronics assembly than Vahid.  Motorola was a very early adopter of lead-free, seeking the advantage of tighter lead spacings that lead-free allows. So, Vahid has been working on lead-free processes since the late 1990s. Motorola has been shipping lead-free mobile phones since 2001. With over 100 million mobile phones in the field since then, Motorola has quite a bit of lead-free field data. I asked Vahid if he could comment on these data. Here is his response:

"In general, the reliability of lead-free solder is equal or better than leaded solder except for BGA/CSP/WLCSPs. The high silver content in SAC387 resulted in poor drop performance of these packages as the joints are very brittle. This issue can be addressed by reducing the Ag content of the solder balls."

Being an early adopter, Motorola qualified the near-eutectic SAC387 solder. So, with SAC387 and SAC105 solder balls, Motorola's field data (for about ten years and over 100 million mobile phones) shows equal or better reliability than leaded solder. While these data do not necessarily support other applications, they are encouraging.

Another encouraging thought is that,
since its debut (with RoHS now about to celebrate its 5th anniversary),  about US$4 trillion of lead-free electronics have been manufactured with no shocking reliability problems.

Although admittedly anecdotal, the IT folks at Dartmouth's Thayer School of Engineering have purchased over a million US dollars in lead-free electronics since RoHS. They have noticed no difference in reliability. This is enough gear, and time, to have the beginnings of statistical confidence.  Compare this to the advent of Microsoft's Vista, it was viewed by these folks as a step backward and they immediately took action to prevent Dartmouth from adopting it. Yet, lead-free adoption went by unnoticed.  The biggest reliability problem with PCs is still hard drive failure.

So concerning lead-free field reliability: The sky is not falling!

Cheers,

Dr. Ron

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Lead Use on the Rise, Bismuth Supplies Secure: Solder Alloy Considerations

Posted by Dr. Ron Lasky on Monday, May 30, 2011

Bismuth crystal.Based on a recent post I published regarding the use of bismuth (Bi) in solder alloys, John writes:

"If Bismuth comes from the production of Pb, and if the use of Pb is being reduced, won’t the availability of Bi be reduced…and the price would increase?"

"Just thinking…"

Dr. Ron responds:

Lead has been banned from many of its original uses, paints, solders, water pipes, gasoline, etc. However, its increased use in batteries has actually caused lead consumption to rise. The USGS estimates that 88% of lead produced is used for lead-acid batteries.

Many of us, in electronics assembly, have been focused on the 2006 RoHS lead ban. This may have caused us to believe that lead use in electronics was significant. About 9 million metric tons (MT) of lead are consumed each year, only about 20K metric tons were used for solders prior to July 2006, this amount is only about 0.22% of the total. Electronic lead use being so small, is likely why the lead industry had little visibility in fighting RoHS. Their important customers were making batteries.

Lead is quite effectively re-cycled, as about 60% of the 9 million MTs/yr are from recycling and 40% from mining.

Over 100 million lead-acid auto batteries are sold each year in the US alone. In addition, the use of lead-acid batteries in fork-lifts, electronic vehicles, and golf carts has increased demand for lead. So, the bottom line is that lead use is expected to grow at about 2% per year.

Considering that we calculated that bismuth use in solders would be at most 5% of total bismuth production, it is unlikely that this use, or lead production reduction, would affect bismuth supplies.

Image source.
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Tin Whiskers found in NASA Study of Toyota Unintended Acceleration Issue

Posted by Dr. Ron Lasky on Wednesday, March 9, 2011

Folks,

Many people responded to my recent post, In Search of Tin Whisker Fails in Lead-Free Soldering.  A few pointed out that the recent NASA report on the Toyota Unintended Acceleration Issue  discussed numerous tin whiskers that were found, one implicated in a failure.  The tin whiskers were emanating from tin plating.

tin whiskersWe don't know, however, if tin whisker mitigation techniques were used. In a mission critical application, such as this, it would appear unwise to use RoHS-compliant electronics, especially since they are not required for automobiles.  In other words, autos are exempt from RoHS.  Let me be very clear, from a tin whisker perspective, I am uncomfortable with RoHS-compliant tin plating in mission critical applications.  Much more work needs to be done before such tin plating should be used in mission critical applications.

In addition, in response to my post, a number of people pointed out the difficulty of proving a tin whisker fail and the reluctance of any manufacturer to admit that their products had them.

But my quest remains unfulfilled; the question remains:

"... who knows of any verified tin whisker fails when tin whisker mitigation techniques where used? Tin whisker mitigation techniques typically use 2% bismuth or antimony in the tin, assure that the tin has a matte finish and use a nickel strike plating between the copper and the tin to minimize copper diffusion into the tin."

Restated, here is my point.  Since RoHS, quite a few people take a position something like this:

With RoHS-compliant assembly, even the world of non-mission critical electronics is at considerable risk of numerous catastrophic failures, due to tin whiskers, that will cost $100s billions.

I still maintain, that with mitigation techniques, such as recommended by iNEMI, tin whisker control, for non-critical electronics, can be manageable.

As I pack up to leave my office today at Thayer Engineering School at Dartmouth, I am across the aisle from the chaps that provide our computers and IT support.  They buy millions of dollars of electronics a year.  In chatting with them they state two things:

1. They have noted no difference in electronics reliability since RoHS implementation

2. On the very rare occasion that they get an electronics failure, it is almost always a hard drive.

Bottom line: Except for hard drives, modern electronics are very reliable for their use life.

I expect my quest will uncover some tin whisker fails, even with mitigation, but the fails will most likely be isolated and not a significant threat to the industry at large.

Cheers,

Dr. Ron

The image is from Dr. Henning Leidecker of NASA, one of the world's leading tin whisker experts.


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In Search of Tin Whisker Fails in Lead-Free Soldering

Posted by Dr. Ron Lasky on Tuesday, February 22, 2011

Folks,

In a recent post, I shared my perspective on the pluses, minuses and neutral aspects of lead-free solder assembly. In the minus category, I listed tin whiskers. A few people commented that tin whiskers were the biggest concern in lead-free assembly. I have trouble understanding this perspective. I’m not saying these folks are wrong, just that I don’t understand their viewpoint.

First, let me say that I appreciate the concern for tin whiskers in mission critical electronics such as military, aerospace and medical. I am also sympathetic to the fact that, even though these types of electronics are exempt from RoHS, they may have to use RoHS compliant products because non-RoHS compliant products may not be available.

When I discuss the topic of tin whiskers, people will point me to NASA’s tin whisker failures website . However, when one goes to the site, there are only about twenty tin whisker fails referenced, many due to bright tin plate. Bright tin plate should never be used in mission critical electronics as it is virtually assured of producing tin whiskers. In addition, many of the articles referenced do not talk about tin whisker fails. Few if any fails are discussed relevant to RoHS (i.e. almost all fails discussed are prior to July 2006.)

I do not want to minimize the significance of tin whisker fails, some of them cost 100s of millions of dollars (e.g. satellite failures). In addition, there have been a few papers that have discussed the formation of tin whiskers even if mitigation techniques are used. Tin whiskers clearly can cause problems, but do not appear to be common, especially if mitigation techniques are used.

So here is my question, who knows of any verified tin whisker fails when tin whisker mitigation techniques where used? Tin whisker mitigation techniques typically use 2% bismuth or antimony in the tin, assure that the tin has a matte finish and use a nickel strike plating between the copper and the tin to minimize copper diffusion into the tin.

Surely if tin whiskers are a major concern, there should be many fails in the over $3 trillion worth of RoHS compliant electronics manufactured since July 2006.

Cheers,

Dr. Ron

The image is from: http://nepp.nasa.gov/whisker/photos/pom/2001august.htm.  It shows tin whiskers on a passive's contacts.Tin Whiskers on Passive Contact
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Status of Lead-Free Solder Joint Reliability in Thermal Cycle Testing

Posted by Dr. Ron Lasky on Tuesday, February 1, 2011

Folks,

Back in October, I posted comments on lead-free reliability.   In this post, I mentioned that I chaired a session at SMTAI on “Alternate Alloys”. At this session, Greg Henshall presented a paper on the  Low Silver BGA Sphere Metallurgy Project. This paper was a collaborative effort of six companies.  In addition, Richard Coyle presented an overview of the work of three companies titled “The Effect of Silver Pb-Free Solder Joint Reliability in Thermal Cycling Testing.Content on the Solder Joint Reliability of a Pb-free PBGA Package.” Both projects evaluated lead-free thermal cycle reliability as a function of silver content and compared the results to SnPb reliability.

Both papers concluded that, as far as 0oC to 100 oC thermal cycle reliability is concerned in their experiments, SnPb < SAC105 < SAC305 < SAC405

Coyle’s presentation summed it up best:

“Each of the SAC alloys outperformed the SnPb eutectic alloy in every test, including the long, 60 min. dwell time test. This tends to diminish the argument that SAC is less reliable than SnPb.”

To be clear, it was two papers by two different groups coming to the same conclusion. It would probably be a stretch to say that the conclusions of either group were “almost unique".

Denny Fritz responded to this blog post with this point:

“No one I know will dispute your ranking of SAC better than SnPb solder using the commercial temperature cycle Henshall uses – 0C to 100C. But, harsh environment electronics have to perform to either -40C or -55C, and most use a top end cycling temperature of 125C. IT IS IN THAT WIDE THERMAL CYCLE TESTING THAT SnPb outperforms SAC solders.”

Denny’s point is well taken. I believe it can be said that SAC alloys have demonstrated acceptable reliability in commercial, non harsh environments (i.e. mobile phones, PCs, consumer electronics, etc.) However, it cannot be said that acceptable reliability for SAC has been established for military (RoHS exempt) and harsh (i.e. automobile engine compartment) environments.

A short time ago, Werner Engelmaier wrote an article on this topic (Global SMT Vol 11, No. 1, Jan 2011, pp 38-40.), which among other things he said:

 

“Of course, ‘Dr. Ron’ selectively picks data agreeing with the point of view he held from the inception of the Pb-ban under RoHS on a plot with an expanded x-axis overemphasizing the differences and supporting a solder joint reliability ranking of SnPb < SAC105 < SAC305 < SAC405.”

 

Ouch! My motives were not quite so nefarious, I chaired a session and wanted to share the conclusions.

 

However, Werner makes good points in his article, data exist disagreeing with this reliability ranking and he suggests some good points on how to conduct reliability tests so that comparisons can be made between data sets.

 

In reading some of his other articles, I was delighted to find that we actually agree on the state of lead-free reliability in thermal cycle testing. Here is a statement of his circa 2008 (Global SMT, Vol 8., No. 8, Aug 2008 pp 46-48.):fting, and n

 

“It has been 2 years since the infamous ban of Pb-solders under RoHS. What have we learned? For solder joints, no dramatic differences in reliability are apparent. The data bases for LF-solders have grown, the favored LF-solders might be shifting, and no reliability model exists as of yet. Nevertheless, progress has been made.”

 

Cheers,

 

Dr. Ron


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The Need for Recycling of Electronic Devices

Posted by Dr. Ron Lasky on Tuesday, January 11, 2011
Folks,

Before the mid 2000s, electronics manufacturers had to be concerned with the challenges of innovation at a low cost. Failure to meet these requirements, resulted in unsuccessful products.  Sustainable design is a relatively new requirement for electronic manufacturers - in addition to all previous challenges. The EU’s WEEE and RoHS laws support sustainable design by virtually requiring that electronic products be recycled. Even products exempt from RoHS, such as medical devices and measuring & control equipment, must meet WEEE’s recycling requirements. 

Recycling National Geograhic 2008Some have argued that the recycling requirement exacerbates the rampant counterfeit component crisis. I am sympathetic to this argument, but the counterfeit component calamity must be solved another way. With the volume of scrap electronics that exists, the world needs safe and effective recycling, as can be seen in the accompanying photograph (National Geographic January 2008).

I was reminded of this recycling requirement when I read of the soon-to-be-published book Solderless Assembly For Electronics (SAFE). The topic of the book is solderless technologies like the “Occam” process . When first announced in August 2007, a number of people, including me, questioned the need for these types of processes and delineated some of the expected difficulties in implementing them. Since then, the need that a product be recycled is another significant challenge to these processes. Soldering enables relatively easy disassembly of PCBs. Most proposed solderless processes copper-plate components to create the equivalent of circuit traces, while the PCB function is built up. Thus, it is more difficult to disassemble a PCB with these types of processes, as the copper bonds melt at 1085°C, much too hot for components and the PCB.

It will be interesting to see how this recycling challenge and other issues facing solderless assembly processes are addressed in this book.

Cheers,

Dr. Ron

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Indium公司在美国SMTAI中的采访录像

Posted by Anny Zhang on Monday, November 1, 2010

在上周行业的SMTAI盛会中,Indium公司有好几位同事被PCB007采访。

首先是李宁成博士(Dr. Ning-Cheng Lee)被采访。他在采访中简述了Head-in-Pillow缺陷和针对此的几种几种检测方法。 李博士和其他几位作者合写的论文,可以在此下载。http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=1&rtwvid=1577


 

接下来是Dr. Ron Lasky简述了他对这四年来实行RoHS的感悟和见解。
http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=1&rtwvid=1576



Tim Jensen
作为Indium公司PCB焊接材料的产品经理,也和大家分享了他对PCB组装焊接材料的一些看法。http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=11&rtwvid=1584

 

Dr. Ron Lasky再次被采访,和大家共享了他研究领域之一:在电子组装中提高产率(productivity)http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=11&rtwvid=1605


最后,最激动人心的是Indium公司荣获了今年SMTA Corporate Award (公司奖)
!http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=6&rtwvid=1614


Cheers!

Video links & Pics: Realtimewith.com



 

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Lead-Free Solder Thermal Cycling & Drop Shock Reliability is Looking Good

Posted by Dr. Ron Lasky on Sunday, October 31, 2010

Folks,

I was at SMTAI (Surface Mount Technology Association International) from September 24 and 27, 2010.   As I mentioned, I chaired a session on Alternative Alloys from 2:00-3:30PM on Tuesday 26th.


At this session, Greg Henshall presented a paper on the Low Silver BGA Sphere Metallurgy Project. This paper was a collaborative effort of six companies. In addition, Richard Coyle presented an overview of the work of three companies entitled The Effect of Silver Content on the Solder Joint Reliability of a Pb-free PBGA Package. Both of these projects evaluated lead-free thermal cycle reliability as a function of silver content and compared the results to tin-lead reliability.

 

Both papers concluded that as far as thermal cycle reliability is concerned SnPb<SAC105<SAC305< SAC405. Coyle’s paper summed it up the best:

 

Each of the SAC alloys outperformed the SnPb eutectic alloy in every test including the long, 60 minute dwell time test. This tends to diminish the argument that SAC is less reliable than SnPb. (See Coyle’s figure. Data curves to the right are more reliable.)

Henshall’s paper also showed that the addition of dopants, to improve shock resistance, in SAC105 does not reduce thermal cycle life.

 

So, it appears, at this time, that, from a thermal cycle and drop shock perspective, it is looking more and more like SAC based solders out perform tin-lead solders in these two reliability arenas.

 

At the end of the session a noted lead-free curmudgeon came over to introduce himself.  We have had a jovial disagreement on several blogs etc. in the past re: lead-free status and issues, but had not met in person.   I should mention that this person is a college graduate, a former technical leader at several influential technological companies, and he owns a PE license. I asked him what he now thought about lead-free reliability after hearing the talks. He claimed that he is a little less likely to think that lead-free reliability is a disaster. He still refuses to purchase any lead-free products. He buys old units (pre-2006) on eBay.

 

I mentioned that over $2 trillion of electronics has been placed in the field since 2006 with no unusual reliability issues.   I then went on to say that a RoHS-compliant product is much more likely to fail due to a non-RoHS related issue. He did not disagree. So then I asked him why he won’t use RoHS compliant electronics. His answer: “I just don’t trust them.”

 

Cheers,

Dr. Ron
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Bismuth: My New Friend

Posted by Brook Sandy on Monday, October 11, 2010
Bismuth CrystalsLately I have been researching a bunch of things, one of my favorite topics being soldering alloys. For a long time most solder (nearly all) was comprised of tin-lead eutectic alloy. Everyone was very comfortable using this alloy until RoHS and other changes in regulations started to tip the scales in favor lead-free alloys, requiring a new approach to soldering materials and processes. The industry, since then, has tended toward using tin-silver-copper (SAC) alloys of various compositions; however none have lived up to all of the properties tin-lead solder offered. In fact, one of the most disruptive characteristics of SAC alloys has been the increased temperature required for reflow, therefore the increased temperature requirements for components and boards.

To achieve enhanced properties, and fill niches that SAC fails to satisfy, research is being done on the addition of dopants to SAC solders. This is where I started to become intrigued with bismuth. The more I read, it seemed, the more I was running across this odd metal that I didn’t know too much about (remember, I’m new to the realm of solder). This prompted a small search that yielded some fascinating facts:

·         Bismuth is a brittle metal, often displaying a pinkish hue due to its surface oxide

·         Bismuth has a low melting temperature (271°C)

·         Bismuth expands upon solidification, kind of like water

·         Bismuth is the heaviest non-radioactive (perhaps considered slightly radioactive), naturally occurring metal on the periodic table

·         Bismuth is not usually mined by itself, rather a bi-product of lead, tin, silver, and other metals

·         Bismuth is the most diamagnetic of all metals

·         Bismuth has the lowest thermal conductivity of all metals other than mercury

·         Bismuth crystals exhibit a reflective rainbow of colors because of the varying thickness of oxide on the surface

·         Bismuth subsalicylate, which is the active ingredient in Pepto Bismol, is outlawed in France (due to outdated concerns about it causing encephalopathy)
Bismuth Crystals
The most interesting attribute of bismuth, from an electronics materials perspective, is that, when alloyed with other metals, it creates low-melting temperature alloys. In particular, when alloyed with tin at the eutectic composition, the alloy melts at 138°C and displays properties comparable to the tin-lead eutectic. The brittleness of bismuth is the main concern when using it for soldering; however, this effect can be mitigated by the addition of more malleable metals to the alloy, such as silver. Many of the popular bismuth-containing alloys contain a high percentage of bismuth, but work is being done with lower concentrations, yielding different properties. Although the melting temperature will not be lowered as dramatically, bismuth at lower concentrations has the potential to enhance performance in drop testing and thermal shock.

Given rising concerns over the cost of metals, bismuth may become more of a contender in the search for alternative solder alloys. I’ve come to think of bismuth as my new friend, because I think that it offers a different avenue for exploration and seems promising for enhanced low-temperature alloys.
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RoHS Helps WEEE

Posted by Dr. Ron Lasky on Saturday, August 28, 2010

Folks,

I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE . One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU.

Fortunately, thousands of folks in the 3rd world will benefit from RoHS, as much recycling is performed by poor people in these countries. When they recycle non-RoHS-compliant scrap electronics, they are being poisoned by lead, cadmium, mercury, and smoke from non-banned organic compounds. This sad situation was again recently brought out in a New York Times article.

As more and more waste electronics becomes RoHS-compliant, the amount of toxic material that these people are exposed to will become less and less. It still shocks me that, when I point out this benefit, a person comments something like this:

“You mean I have to put up with RoHS just to help these people?”

It is my fervent hope that very few of us feel this way.

Cheers,

Dr. Ron

Image source.

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RPN is an Approach to Evaluate Tin Whisker Risk

Posted by Dr. Ron Lasky on Saturday, June 12, 2010

Folks,

Tin Whiskers (TW) continue to generate considerable interest. People often suggest that their risk is great and yet unknowable. RPN may help to clarify the TW risk. What is RPN? It is the risk priority number from failure mode and effect analysis.  As this link tells us:

A failure modes and effects analysis (FMEA), is a procedure in product development and operations management for analysis of potential failure modes within a system for classification by the severity and likelihood of the failures. A successful FMEA activity helps a team to identify potential failure modes based on past experience with similar products or processes, enabling the team to design those failures out of the system with the minimum of effort and resource expenditure, thereby reducing development time and costs. It is widely used in manufacturing industries in various phases of the product life cycle and is now increasingly finding use in the service industry.

RPN is an important part of FMEA. It is the product of three numbers that range from 1 to 10. The first number is the severity (S) of a possible fail. A “10” would be given if the failure injured someone, “7” would be assigned if the failure caused a high degree of customer dissatisfaction, whereas a “2” would be given if the failure has only minor negative effects.

The second number is occurrence (O) of a fail. The highest rating is a “10,” which would be a failure every day (reminds me of Windows ME!) or one fail in 3 events, whereas a “7” would be a failure every month or one in 100 events. A “2” is a six sigma fail rate.

The last number is detection (D) of a potential fail. A”10” would suggest that the detection of a potential fail is either not performed or not possible. A “7” is a manual detection approach that may not be reliable, whereas a “2” is 100% effective potential failure inspection.

So obviously a product with a RPN of 10x10x10 = 1000 is a disaster, its failure is dangerous, frequent and incapable of being detected beforehand. Industry rules of thumb suggest that and RPN of 200 needs to be addressed and an RPN of 75 is usually considered acceptable.

Let’s look at a “ball park” RPN for tin whiskers (TW). We will assume the application is a critical IC in a PC.  Let’s assume that a severity rating of “S” of 8 (failure renders the unit unfit for use) is reasonable. TW are hard to inspect for future fails, so detection, “D,” could be as high as a 10. At this point we are at 8 times 10 equals 80 for both. A bad start.

Occurrence , “O” for TW failure modes is dramatically different. When trying to assess the occurrence of TW fails, one is often directed to NASA’s web page . Many reference this web site that lists a little more than a score of TW fails. What escapes me is that people don’t seem to appreciate the rarity of less than 100 fails in decades of data collection. Surely TW fails are not common. I could find no report of a failure of a RoHS compliant product anywhere on the internet. So it would be hard to rate “O” any higher than a “2.” I suspect that the reason few TW fails have apparently occurred is due to TW mitigation techniques that are widely practiced.

I would expect that “modern” process defects like the head-in-pillow or graping defects could have a much higher RPN than TW, if assembled without proper process controls and materials. However, there is little need to worry about these defects either, if you use the right solder paste and practice some assembly process precautions.

Cheers,

Dr. Ron

Image: http://blogs.indium.com/blog/an-interview-with-the-professor/0/0/ed-briggs-weighs-in-on-graping
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Lack of Data to Support "Tin Whiskers' Being Major Reliability Concern for Toyota

Posted by Dr. Ron Lasky on Sunday, March 28, 2010

Folks,

 Bob Landman’s comments to my tin whisker posts appear below. Friendly dialogue such as this helps us to all learn more and is appreciated. Thank you Bob, keep me honest!

However, Bob’s comments do not change my position, which is:

1.     Tin whiskers exist and can cause failures

2.     However, there is yet no data that suggest that there are numerous tin whisker failures, or that a significant reliability risk exists due to tin whiskers in RoHS-compliant products.  NASA's TW website notes only 26 fails.

3.     Although not completely understood, tin whiskers can be created in the lab, and mitigation (not elimination) and reliability test techniques exist and have been demonstrated.

4.    With well over $1 trillion in RoHS-compliant electronics manufactured since the early 2000s, there have been no significant reliability issues as compared to tin-lead solder.

5.     Long term lead-free reliability (> 5yrs) has not been demonstrated. Hence, mission critical products should not use lead-free electronics at this time.

6.     Tin-lead solder does not assure defect-free electronics with perfect reliability.

 

As I type this post, I am surrounded by more than 20 RoHS-compliant products, some dating from 2005. Outside my office, at Dartmouth’s Thayer School of Engineering, is our computer center. The thousands of RoHS-compliant products that the computer center buys each year (they get me my laptop, etc)  are almost all RoHS-compliant. No unusual reliability issues have been noted.

Bob mentions that CALCE reports that 31% of laptops fail in 3 years. This number actually seems low to me. Upon reading the paper, one finds that over 10% of the 31% is due to accidents. 
A study of 100,000 hard drives at Google suggests that hard drive fails are in the 5% range per year, which may account for much of the 20% of fails in 3 years. But what solid conclusion can be made from these data? Nothing, unless failure analysis is performed.

The sky is not falling. Lead-free has process-ability and reliability challenges, such as graping, head-in-pillow, voiding, etc. With data-driven process optimization at all steps in the manufacturing of the ICs, components and assemblies, good lead-free yield and reliability can be achieved.

Lead-free is here to stay. It is up to us to perform the experiments and develop the techniques to assure that RoHS compliant products have acceptable reliability.

Bob's comments follow:

My source for the dead vehicles that arrive at car dealers having whisker problems, comes from my former professor of physics, Dr. Henning Leidecker at NASA Goddard Space Flight Center in Greenbelt MD.   Dr. Leidecker said that in the last four years his office has been contacted by seven major suppliers of automotive electronics inquiring about failures in their products caused by tin whiskers. He said his office has contacted Toyota offering to help analyze its acceleration problem, but hasn't heard back. For full context, read the rest of the article [http://wtop.com/?nid=108&sid=1898265].

Ron Lasky confirms that parts plated in pure tin will grow tin whiskers "with a certain amount of aging". According to NASA, whiskers can grow in hours, days, weeks, months or years. It depends on at least six factors; the quality of the tin plating, the residual stress in the coating, was the coating annealed or not, grain uniformity, temperature, humidity, and unknown other factors we don’t yet understand which is what makes it so difficult to stop whiskers from growing and is why there are so many papers published on the subject (as you can clearly see at John Barnes website) yet we still do not understand why or how they grow.

So yes, is entirely within the realm of possibility that "new" products have failed due to tin whiskers or perhaps dendritic growth.

NASA cannot tell us who the manufacturers are who reported these events due to confidentiality agreements.  Dr. Leidecker says they get these calls from other industries as well and most request a non-disclosure agreement.  NASA feels it’s better to get some information rather than none, don't you agree?

Last  week at CALCE at UMd. it was reported that 31% of all laptops fail within 3 years. This is the link to the report http://www.squaretrade.com/pages/laptop-reliability-1109/  No information is given as to what has failed. Is it due to whiskers?  We do not know.

What we do know is that the laws of physics have not been repealed.  Tin will most certainly grow whiskers so using leadfree solder and tin plated components has to result in tin whiskers growing.

NASA continues to log failures.  NASA Goddard is now studying the Toyota incidents for NHTSA.  Again, a non-disclosure statement has been signed so they cannot comment on the study at this time.

Dr. David Gilbert of Southern Indiana University has demonstrated that a low resistance or shorted input between the wires from the pedal electronics to the electronics control module will cause Toyotas to open their throttles full.  Perhaps the problem is due to leadfree manufacturing (which Toyota admits it began in 2002-3)?  Perhaps it is software?  We don't yet know but we can be reasonably certain that not all the accidents are caused by the owners of the vehicles.  You can see pictures of the Toyota parts at my website [www.hlinstruments.com//RoHS_articles/Toyota/]   The pedal has a pc board layout that I would have been comfortable with.  In particular, the SOIC part that converts the signals from the Hall effect sensors (that sense pedal position) into 1-5Vdc signals sent to the electronic control module is very close to the edge of the board.  The board has serrated edges which indicates it was snapped out of a large panel of these boards after the parts were soldered to it.  It's possible a trace or lead has fractured or one of the capacitors or resistors.  We know that leadfree solder is more brittle than tin-lead. Perhaps a few boards are marginal and over time a lead opens or becomes intermittent?

The EU was warned that tin whiskers and brittle joints would result if lead was banned from electronic assemblies but went ahead and banned lead from tin-lead solder and platings on parts. They acknowledged the possibility of reduced reliability under intense pressure from hi reliability industries and did exempt some products (military, aerospace, etc...).  What difference did it make since the majority of component manufacturers refused to continue to offer tin-lead plated leads?  That is why NASA replates it's components with tin-lead at Corfin Industries and uses only tin-lead solder.


Bob Landman


Cheers,
Dr. Ron

The image is a Toyota accelerator pedal position sensor board from

http://www.hlinstruments.com//RoHS_articles/Toyota/Toyota%20Dr%20Gilbert%20Preliminary_Report022110.pdf


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