Jim Hisert

Are you looking for information on semiconductor packaging materials?  Send your request to jhisert@indium.com.  It’s all fair game – released, experimental, or competitor materials.  Flux characteristics, paste properties, application methods…

Inquire about any of the following topics:

• Pin transfer
• Package-on-Package (PoP)
• Solder spheres
• Glass transition temperatures (Tg)
• Flip chip assembly
• BGA rework
• Cross-sectioning electronic components
• Paste for component dipping
• Solder alloys
• Liquid fluxes
• Wafer bumping
• Low alpha solder
• Spin coating
• Redistribution layers (rdl)
• Halogen-free
• Flux viscosity
• Solder paste viscosity
• Whatever else you are interested in