From One Engineer to Another

Solder Thickness for PV Interconnect

Monday, June 15, 2009 by Jim Hisert [Jim Hisert]
X-section of tabbing ribbon showing solder thickness

X-section of tabbing ribbon showing solder thickness

Solder thickness is important whether you are interested in tabbing ribbon, bus ribbon, or (most likely) both types of PV interconnect materials. In almost all tabbing/stringing applications, the solder coating on the interconnect ribbon provides 100% of the solder used to form a metallurgical bond on top of solar cells.  With this in mind, the solder coating should be more than just a 'shiny finish' on the tabbing ribbon – but what is the proper thickness for soldering?

 

Indium Corp. has been making precision solder coated ribbon for quite a long time (and not just for tabbing/stringing).  This experience has taught us how to control solder thickness, and also what thicknesses work in various applications.  If you would like to learn how solder coating thickness affects the reliability of your solar cell, email us at: solar@indium.com.

 

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Comments for Solder Thickness for PV Interconnect

Tuesday, April 6, 2010 by jong sik:
Dear jim Hisert I read your document through the internet I am studying for PV Module in korea I have some questions about Ribbon and Cell. So I send you e-mail and want to get some advise 1.Ribbon thickness It is composed of cu and solder(PbSnAg). Cu thickness is 150㎛ and Solder thickness is 20㎍. Is Solder thickness good condition or not ? would you recommend to me your opinion? we should raise up solder thickness or not. if raise up, what's the wrong? if raise down, what's the wrong? 2. after tabbing ( it's assembled with Ribbon and Cell ), we don't know well good assembled or not. so i peel off ribbon from bonded condition on cell and ribbon. when i check this, i get some different results and have some questions. first, when peeling off ribbon, Ag Paste was divided from wafer ( cell is wafer and ag Paste) second, when peeling off ribbon, somd wafer parts(silicon) of the cell was divided from wafer third, some parts of the assembled cell and ribbon are not assembled with cell and ribbon. is it bad or not. i read another document(thesis), is telling no problem if that is assembled over 70% of the total assembled length (ribbon and cell) Please help me and give some advice
Tuesday, April 13, 2010 by Jim H.:
Hi Jong Sik, You should have recieved a personal email regarding the answers to these questions. If for any reason you didn't find my email, just let me know: jhisert@indium.com Thank you, ~Jim

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