In my opinion, microsphere bumping is the best combination of cost, simplicity, and precision for bumping.
Wafer level packaging shifts some of the common assembly house steps back to the wafer processing stage. This transfer of this responsibility allows all of the die on a wafer to be processed at once, saving time and reducing cost. This week we'll discuss the materials that are needed, and the benifits of using the proper materials.
Subscribe to RSS Feed
Powered by Compendium Blogware
Comments for Wafer-Level Microsphere Bumping