A lot has changed in the world of package-on-package in the last few years. The most obvious change that I have seen is the development of specialized pastes for component dipping. If you haven’t tried one of these pastes, here are 8 reasons why you should:
8) More consistent transfer over time
7) Head-in-pillow elimination
6) Better wetting to a range of alloys
5) Optimized metal loading
4) Specially designed powder distribution
3) Halogen-free flux formulations
1) Higher possible yields
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