Indium Corporation
From One Engineer to Another®

How Low is Low Temperature in Soldering?

Monday, April 9, 2012 by Carol Gowans [Carol Gowans]

Do you ever have a need for a "low temperature" solder (meaning an alloy that melts at less than 175C)?

You may have delicate components that cannot withstand standard reflow temperatures, or maybe you are looking to reduce costs by lowering the reflow temperature, or you may be step soldering.  Whatever your reason, there are two unique metals that are used extensively in low temperature solder alloys.

Low Temperature solder alloys can be fabricated into many shapes and forms.The first one I am sure you can guess: Indium.  The other one is Bismuth. While these two elements are used extensively in the over 100 alloys available in the 50C to 175C range, they couldn't be more different from each other.

Indium is a very soft, malleable metal and remains so even at cryogenic temperatures. It melts at 156C.  Bismuth, on the other hand, is very brittle, even at room temperature, and melts at 271C.  But both lend themselves very nicely to solder alloys that melt below 175C.

Let's look at the two most common alloys in these families.

The two alloys:

  • 52In 48Sn (Indalloy #1E) Melts at 118C
  • 58Bi 42Sn (Indalloy #281) Melts at 138C

What they have in common are:

  • Both are lead-free
  • Both are tin-based
  • Both are eutectic (liquidus and solidus temperatures are the same, with no plastic range)
  • Both can be made into a wide variety of solder forms and can be used in low temperature applications

But the indium-based alloy will give you better compensation of coefficient of thermal expansion (CTE) mismatch than the bismuth alloy.  The bismuth alloy has greater tensile strength but has a lower shear strength than the indium alloy and is generally not recommended in applications where the product has potential to be dropped (like cell phones).  The indium alloy will give you greater thermal conductivity than the bismuth, as well.  The bismuth will give you a cost advantage.

So, which alloy do you use?  Well, that depends on the metallizations you are working with and the environment in which your final product will be operating. For example, if you are soldering to two different surfaces that expand at different rates, then you will want to go with the indium alloy - to keep your solder joints from cracking.  But, there are a lot more considerations when choosing a low temperature solder, and we can help you sort through them.  Check out our Low Temperature Solder page on the web or contact us at AskUs@indium.com or contact me directly at cgowans@indium.com and we can answer your questions or put you in touch with one of our local experts to review your entire process for the best solution.

Let us help!

Carol Gowans

Happy Birthday Indium Corporation!

Wednesday, March 7, 2012 by Carol Gowans [Carol Gowans]

March 13th is the 78th anniversary of the founding of Indium Corporation.  Dr. William S. Murray, J. Robert Dyer JR, and Daniel Gray combined to create a company that was, in 1934, on the cutting edge of technology at the time - and that still is today.

Although some of the initial attempts to utilize indium were decidedly low-tech (plating of silverware and use in gold dental alloys), the first real breakthrough came when Mr. Dyer developed the process to indium-plate aircraft engine bearings to make them last longer.  Today our indium metal is in thermal interface materials, batteries, medical devices, aerospace devices, solar panels, flat panel displays. Of course, the full range of Indium Corporation products (including materials that contain no indium at all) can be found in a myriad of electronic devices.  We hold a wide variety of patents and have conducted endless tests and experiments including some aboard the space shuttle.

In between we have been featured in the Wall Street Journal, Business Week and many other technology journals and received awards for our technical expertise and our customer service.

Our original founders were very "hands on" in their approach to developing their company and we still follow that approach today.  Our sales and technical staff, locally located around the world, are as comfortable in a lab or on a production floor as they are presenting a technical paper.

A Few Packaging OptionsContact us at AskUs@indium.com to utilize our expertise and let us heOriginal Bottle of Indium Preformslp you with your challenge.

Shown here is an original bottle of indium solder preforms with a hand written label.  Today we have a variety of packaging options with printed labels and bar codes to fit your product and application.

Carol Gowans cgowans@indium.com

 

Soldering Nitinol: The Oxides Are Reduced, Now What?

Friday, March 2, 2012 by Carol Gowans [Carol Gowans]

Reducing the surface oxides of Nitinol is just the first step in getting a good solder joint with this versatile medical assembly material.

Next you have to choose the right solder alloy.  You will probably want to stay away from anything containing lead, cadmium, or antimony, particularly in medical applications.  And you will want something with a high tensile strength.

The best choice is Indalloy #121 (96.5Sn 3.5Ag).  It has a tensile strength of 5,620 PSI and a melting temperature of 221C and is obviously lead-free.  It wets well to the cleaned Nitinol.

If you need a higher melting temperature solder (one that can withstand autoclave temperatures for example) you should consider Indalloy #182 (80Au 20Sn) which melts at 280C, has a tensile strength of 40,000 PSI, and has long been considered a highly reliable solder.  Additionally, this alloy is available in very fine diameter solder wires to minimize waste.

Soldering temperatures should be 25C to 50C above the liquidus temperature of whichever solder you use and proper cleaning should be always be performed afterwards.

Contact us at medical@indium.com for more information about soldering for medical devices or visit our web site at www.indium.com/medical

Carol

 

Indium Supply Will Satisfy Demand For 75 Years

Friday, February 17, 2012 by Carol Gowans [Carol Gowans]

As reported in Metals Bulletin, Malcolm Harrower of Indium Corporation recently addressed the topic of indium availability and supply as he told the delegates at the Minor Metals 2012 conference in Brussels that:

  • there is no shortage in the supply of indium metal
  • nearly 1,500 tonnes of indium was produced in 2010
  • there are 50,000 tonnes of proven indium reserves in existing mines, a volume that will be sufficient to satisfy demand for the next 75 years,

Just 80 years ago, the potential for indium was just being discovered.  An article that I found in theVintage Indium Corporation Logo archives of Science News from 1932 indicated that 10 lbs. of indium was due to be produced that year and it would give scientists a chance to do some great research on the possible uses of indium.  Twelve years later in 1944 another article was written on one of those uses which was to lubricate ball bearings to make them last longer (an application still in use today).  That article stated that the output had reached 500,000 troy ounces (34,250 lbs). 

Now 80 years after indium was first commercially produced, the yearly output has reached nearly 1,500 tonnes (3,300,000 lbs) per year, with about two-thirds of that being reclaimed and recycled material.  The versatility of indium has certainly driven that growth into all kinds of applications including:

1) Touch screens

2) Battery chemistry

3) Electronic thermal interface materials

4) Solders

5) Cryogenic and hermetic sealing

6) Solar panels

And as technology evolves, we expect to see more uses as time goes on.  Learn more by visiting our web site at www.indium.com. Or email/call me to discuss your needs.

Carol

cgowans@indium.com

+1-315-853-4900

The Right Flux for Soldering to Nitinol

Wednesday, February 15, 2012 by Carol Gowans [Carol Gowans]

Soldering to Nitinol with Flux 2Eric Bastow recently wrote about using our Indalloy Flux #2 for soldering to Nitinol.  He did many tests and wrote an Application Note called Soldering to Nitinol.

Fort Wayne Metals, a leading supplier of medical wire (including Nitinol) also did a test on various fluxes as they relate to break load (maximum load before the joint breaks.

The fluxes tested included:

  • Indalloy Flux #2 and Flux #3
  • Indalloy Flux #5RMA; #5R; #5RA
  • Indalloy Flux #4R
  • Flux #400 (no longer commercially available)


The #5 series and the #4R were found to not be strong enough to clean off the tenacious oxides formed on Nitinol. Therefore, they didn't enable the solder to wet the surface properly.

Flux #2 and Flux#3 gave the best results (of the fluxes tested for break load) since they removed more of the oxides and allowed for a stronger solder bond.

Want to know more about soldering to this important medical material?  You can contact Eric Bastow directly at ebastow@indium.com or email us at medical@indium.com

Carol Gowans

cgowans@indium.com

 

Soldering Materials & Processes: Advice From Our Technical Library

Thursday, February 2, 2012 by Carol Gowans [Carol Gowans]
Indium Corporation white paper technical library online solderLooking for tech papers that answer the most basic soldering questions? These rank among our most frequently downloaded:
If you are new to soldering, or need a refresher, check them out in the Indium Corporation Tech Library. Information is available in multiple languages.

If you don't see exactly what you are looking for, search the Indium Corporation blogs, or contact an expert directly. You can even send your request directly to me and I will put you in touch with the right person.

Carol
cgowans@indium.com
+1-315-853-4900

Solder Wire

Tuesday, August 2, 2011 by Carol Gowans [Carol Gowans]
Indium wire: solder, cryogenic hermetic sealing, die attach, thermal interface managementSolder wire is generally used for manual soldering operations, including rework.  But, it can also be used in automated applications such as die-attach soldering.  Solder wire can be flux-cored, or solid with a separate flux used.

Each application can have different requirements for the wire.  For example, wire used in die-attach applications needs tight dimensional tolerances to insure an exact, repeatable amount of solder is deposited each time.  Reduced oxides are also critical to eliminate any "splattering" of the molten solder during the deposition process.

Wire can also be used for non-soldering applications. For example, indium (and indium alloys) wire are often used as a sealing material (particularly in cryogenic sealing applications) - more here) and as a thermal interface / management material.
Sn Ag Die Attach Wire
Decades ago, 0.030" (0.76mm) diameter was the standard size, but today we are able to produce diameters as small as 0.001" (0.025mm) in tin silver (Sn Ag), tin silver copper (SAC) and gold tin (Au Sn) alloys.  Considering that a human hair is about 4X that size, that is a very small diameter!  Pure indium wire is limited to 0.010" (0.254mm), but alloys containing indium can be produced smaller than that.

The wide variety of diameters available in Au Sn make this alloy ideal for the complex applications in medical, aerospace, and other high reliability applications.  However, the Sn Ag and the Sn Ag Cu are used across a variety of standard applications that require lead-free materials.  Sn Ag is particularly good in soldering to Nitinol.

At first look, wire seems like a pretty simple product.  But specifying the right alloy, diameter, tolerances, and packaging can make all the difference.  It can help you achieve a repeatable process that gives you high yields, strong solder joints, and enhanced profitability.  For further information - contact me.

Carol Gowans

Indium Wire and Cryogenic Sealing

Monday, June 20, 2011 by Carol Gowans [Carol Gowans]
Indium wire is ideal for many sealing applications, especially cryogenic sealing.  There are two main advantages to using indium wire in your cryogenic sealing applications:  

Malleable indium

  • It remains malleable at cryogenic temperatures
  • It is soft and pliable so it fills imperfections in mating metal surfaces and creates a hermetic seal


Most materials used for sealing that work at standard operating temperatures will crack and break at the -150C cryogenic temperatures.

Often cryogenic, or any sealing, applications require that a seal be made inside a channel or other feature that isn't always flat and smooth.  To illustrate how this works with indium, I used a piece of indium foil to show how it conforms to the surface of this penny.

Read more about indium metal in general or indium wire in particular.
Or, contact me directly.

Carol Gowans
June 2011


 

Solving Solder Starvation in SMT Electronics Assembly

Wednesday, June 1, 2011 by Carol Gowans [Carol Gowans]
Solder Paste StencilSolder starvation is a serious electronics assembly issue - with a very simple solution.

Solder starvation occurs when adequate volumes of solder are not available to effect a perfectly-shaped solder joint. The consequences include:
  • weak solder joint strength
  • open solder joints
  • intermittent short circuits
  • reduced first-pass yields
  • increased inspection
  • increased rework
  • field failures
  • damage to your company's brand & image
  • reduced sales and profits

Frequently, solder starvation occurs in Surface Mount Technology (SMT) when solder paste deposits are inadequate.  This happens because: 
  • Solder Fortification™ preforms packed in tape & reel packaging, for use in existing SMT production lines.The single-thickness stencil is designed for the majority of smaller components, starving the few larger components of solder volume.
  • High-use interfaces, such as connectors and USB ports, require extra solder - to assure their solder joints survive the constant use in the field.
  • Smaller, more tightly compacted circuit boards don't allow for deposition of enough solder paste.
So, how do you solve this increasingly common problem without impacting your process or your cost? 

Solder Fortification™ preforms are the simple answer:
  • You can add solder just where you need it without overprinting solder paste or working with step stencils.
  • Preforms deliver precise, repeatable volumes of solder.
  • Preforms can be added during your existing SMT process with existing pick & place equipment.
  • Preforms eliminate the need for rework or hand soldering at the end of the process.

For more information, contact me at solderfortification@indium.com or visit our web site at www.indium.com/solderfortification.

Carol Gowans
Market Manager

Solder Preforms in a Hurry

Wednesday, March 30, 2011 by Carol Gowans [Carol Gowans]
I recently visited a customer that was doing a lot of hand soldering. I always marvel at the variety of techniques and processes that are developed in an attempt to reduce variability and increase throughput for this very exacting work.

EXAMPLE: assembling connectors

Placing individual solder washers (sometimes quite small) can be very time consuming.  It is also very easy to either place too many washers or not enough and not detect the problem before it comes back at rework.

Take a look at this video that shows the difference between placing individual solder preforms and InTEGRATED® Solder Preforms.

A single placement of an InTEGRATED® Solder Preform improves your throughput and accuracy in one motion. This goes directly to your bottom line.

If you would like more information on this ingenious product, check out InTEGRATED® Preforms or contact us at askus@indium.com.


MD&M Show in Orlando

Monday, March 7, 2011 by Carol Gowans [Carol Gowans]

The week of March 14th Indium Corporation will be exhibiting at the MD&M (Medical Design & Manufacturing) show in Orlando, Florida.  Actually it is one of many MD&M shows held throughout the country.

We have attended previous shows as visitors but this will be our first as an exhibitor.  We will be showcasing our Flux #2 and lead-free solders for soldering to Nitinol.  Eric Bastow recently wrote a blog post on using Flux #2 and either 96.5Sn 3.5Ag or 80Au 20Sn for this application.

Flux #2 cleans off the very tenacious oxides that form on the Nitinol, giving it a clean surface to solder to.  We will be providing further details and samples of the 96.5Sn 3.5Ag in wire form at the show.  You can also request a sample of the Flux #2 by giving us your contact details.  Stop by and see us at Booth 248-250.

Or you can contact Eric Bastow by email at ebastow@indium.com or me by email at cgowans@indium.com.

Happy Birthday, Hieronymus Theodor Richter! Co-Discoverer of Indium.

Monday, November 22, 2010 by Carol Gowans [Carol Gowans]

Richter discovered indiumNovember 21st is the birthday of one of the men who co-discovered indium metal back in 1863.  Hieronymus Theodor Richter, along with F. Reich, made the discovery but it wasn't until 1924 to 1933 when Daniel Grey created a process to extract and refine indium that the commercial possibilities began to be explored. Their work led to the founding of The Indium Corporation in 1934.

Dr. William S. Murray, the founder of Indium Corporation, received the first patent to process indium in 1926.  The first commercial quantities of indium were discovered in Kingman, AZ in the same year.

The importance of indium metal grew through the rest of the 20th century, in conjunction with each new technology discovered.  Whether it was its malleability (even at cryogenic temperatures), its low melting point, its electrical conductivity, or its thermal properties, indium has become a standard in almost every industry for unique as well as common place applications. 

Today indium is used in a variety of applications: as a low melting solder in electronics applications, as a coating for touch screens, LCDs, and solar panels, as well as a thermal interface in many of our heat-producing electronics.

Although indium has a relatively short history, particularly from a commercial standpoint, new discoveries and applications for this unique metal continue to be made.

For more information on indium, go to www.indiumsolders.com.


IMAPS 2010 and SMTAI

Friday, November 5, 2010 by Carol Gowans [Carol Gowans]

Spending back-to-back weeks at two electronics assembly trade shows is a unique experience, to me.

First up was SMTAI in Orlando, FL where I helped present a paper on Solder Fortification Preforms

How does one "help" present a paper?  Have you ever listened to a great paper and then, at the end, seen so many people rush around the speaker that no one can get a chance to make a further connection?  My role was to be available as an additional resource for answering questions after the presentation.

The second show was IMAPS 2010 in Raleigh, NC.  This is one of the best showcases for our Engineered Solder Materials.

There are many facets to the trade show experience. 

  • There is the booth, which has to have the right message and the right pictures to draw the right people in. Our message is "From One Engineer to Another". Most of our staff IS engineers. Our team is extremely knowledgeable about materials and assembly processes.  We provide the best service when we are talking with Process or Design Engineers that need our soldering or bonding expertise.   
  • There are the technical presentations, as mentioned above.
  • There is the networking with industry leaders.  Being able to visit a variety of complimentary suppliers and discussing topics we have in common is tremendously valuable.


Even in the face of the myriad technology devices that keep us connected 24 hours a day, there is still nothing like that face-to-face experience.  The IMAPS Global Business Council presented two speakers during the show: one from DuPont and one from Dow.  One of them (I am sorry I can't remember which one) stated the overwhelming importance of getting their Application Engineering staff into the field to work face-to-face with customers.  

So if you want to more about what we know, check out our blogs.  When you see something you like or want to know more about, call us or email us.  We are glad to work with you!

And if you want to hear another viewpoint on trade shows, check out Andy Mackie's blog.


Engineer to Engineer at IMAPS in North Carolina

Wednesday, October 13, 2010 by Carol Gowans [Carol Gowans]
Indium Corporation will be at IMAPS 2010 (International Microelectronics and Packaging Society) - their 43rd International Symposium on Microelectronics - again this year, doing what we do best: talking From One Engineer to Another.
 
Our booth will feature a strong team of experts from our Solder Preforms, Solder Paste and NanoFoil programs.  We will have samples and displays that will give you the chance to partner with us on your soldering, joining, bonding, or other material challenges and to find an efficient solution.

You can get all the details for the technical programs at the IMAPS web site.  They provide five different tracks including: 3D packaging, modeling and reliability, next generation materials, assembly and packaging, and advanced technologies.

And then, of course, there are the booths.  IMAPS 2010 provides both exhibitors and visitors the chance to talk face to face and sketch out processes and find solutions.  Come visit us at Booth 415.  You can talk with Chris Nash, Seth Homer, Tommy Acchione and me to get insight into the latest materials.

If you wouldl like a free pass to the exhibit hall, contact me at cgowans@indium.com and I will send one out to you.  The exhibits start on Tuesday November 2nd and continue through Thursday November 4th.  We hope to see you there!

Think Like a 12 Year Old

Tuesday, August 31, 2010 by Carol Gowans [Carol Gowans]
Did you ever hear the expression, "think like a 12-year-old"?  Meaning a 12-year-old has enough learning to address a problem but not so much experience that they rule out possible solutions.

I have a five-year-old nephew who just loves to figure out how things work and how to use them.  The other day at a picnic as all of us adults tried without success to unscrew the top to a giant container of pretzels he pointed out that there was a piece of plastic that had to be pulled off first to release the lid.  Now in my own defense it wasn't well marked and he was right at the eye level to see the key bit of plastic, but still he solved with his brain what we couldn't solve with our muscle.

I don't want to say we have a lot of 12-year-old minds (or even 5-year-old minds) working here, but I have seen a lot of innovation here at Indium.

One of the most interesting innovations we have developed (and possibly simplest) is Solder Fortification Preforms.  There are many instances when solder paste stencilling just doesn't leave enough solder paste to form a strong enough joint.  Either the joint has additional strength requirements (like a connector) or a thin stencil is being used and there is no way to get enough solder down efficiently.

The solution is to add a solid piece of solder (no flux added) into the paste deposit to increase the volume of solder.  These solder preforms come in standard sizes (similar to component sizes), standard alloys (to match your solder paste alloy) and are packaged in tape and reel so your in line pick and place equipment can easily be used to add the solder preform.  You can try out an evaluation reel through our ecommerce site or by contacting us at esolders@indium.com.


How Small Can Your Solder Go?

Monday, August 23, 2010 by Carol Gowans [Carol Gowans]
George Will once said, "The nice part about being a pessimist is that you are constantly being proven right or pleasantly surprised."

Well, at Indium Corporation,  the same may be said about being an optimist.  I have had two requests this week for smaller-than-standard products (indium solder wire and indium solder paste).  Both requests were for 97In 3Ag.  And when I asked the product manufacturing engineers about trying them, they both independently said, "Sure let's give it a try".

The indium solder wire request was for a .008" diameter solder wire.  Pure indium wire is difficult to make less than .010" because it is very soft.  But add enough silver and it gives it the additional tensile strength it needs to go through the wire manufacturing process.

The other request was for Type 5 indium solder paste.  One of indium's unique physical properties is its ability to cold weld to itself, a great feature when you are bonding non-metallics plated with indium together, but not so great when you are trying to make tiny spherical shapes (powder) that are intended to remain suspended in flux vehicle to work properly.

As the electronics we crave get smaller and smaller and require non-standard solder solutions, I am sure we will be getting more and more requests for these "let's give it a try" projects.  Stay tuned to find out how we make out!

There've Been Some Changes Made

Monday, August 16, 2010 by Carol Gowans [Carol Gowans]
Indium Solder WireWhen was the last time you were in your favorite store and headed toward your favorite aisle only to find that they have rearranged everything?  Of course, they do that to attract your attention to different items, but it is only for their benefit.

At Indium. we have made some changes on our e-commerce site but these are for your benefit.  We summarized the solder wire, solder ribbon and research kit options so you can more easily find a solution to your application. 

The solder ribbon and solder wire sections give a summary of the available alloys and the prime characteristics to help you home in on the proper alloy.  The research kit section has had like kits grouped together into solder, thermal management, plating, solar tabbing and NanoFoil options.

And, because budgets are tight, but the work still has to be done, we have lowered the prices on the individual solder wire and ribbon options and added a 10ft wire option.  You can still buy the research kits that have multiple items at a great price, but if you have narrowed down your choice to that one best option, you can test it for less than $100.00.

If you need a little extra help in determining the best solution, we have a lot of ways for you to contact us:
1) Live Chat (see our home page)
2) Askus@indium.com
3) Regional technical support personnel
4) esolders@indium.com
5) Call us at 1-315-853-4900 or 1-800-446-3486


Soldering 101 CTE Mismatch

Tuesday, August 10, 2010 by Carol Gowans [Carol Gowans]
The Northeast USA (as well as other parts of the country) have been experiencing quite a warm summer.  And, if walking out into the humidity wasn't clue enough, I would just have to test the fit of the old doors in my house because they stick.  The heat causes them to expand.

Heat also causes metal to expand.  Which would be okay if all metals expanded at the same rate (CTE or coefficient of thermal expansion), but of course they don't.  So what happens when you try and solder two metals together and then apply heat (either on purpose or through use of the device)?  You have what is commonly known as a "CTE mismatch" that causes the resultant solder joint to crack upon cooling, and results in failure of the device. 

So, how do you overcome CTE mismatch when joining two metals together?  Use indium of course!  The indium is soft enough and malleable enough that it basically stretches in accordance with the metals it is attached to.  It can be used in a variety of forms (indium wire, indium preforms) and in a variety of alloys to overcome the CTE mismatch in your product.


Indium 101 - Earth Abundant Material or Rare?

Friday, May 14, 2010 by Carol Gowans [Carol Gowans]

Wandering through the references to indium metal on the internet, I sometimes see it referred to as, "that 'rare' metal. But is it really so rare?  I recently talked to my colleague, Claire Miko, Director, Metals and Chemicals for Indium Corporation and asked if the reports of the rarity of the metal (like the death of Mark Twain) were greatly exaggerated.

 
 

Question The element indium is widely used today in many electronic (glass coating, low temperature solder, hermetic sealing and thermal interface material) and solar applications (CIG solar panels), but very little is known about it.  Can you tell us where indium metal comes from?

Claire:  Indium is a by-product of several base metals such as zinc, lead, copper, tin and other poly metallic ores. It is very abundant on the crust of the earth (much more than silver for example and the annual silver production is at least 40 times bigger than the annual indium production). Geographically indium is abundant in South America, Canada, Australia, China and the CIS, i.e. the reserves are widely spread.


Question
:
     Does indium have to be refined after it is mined?

Claire:    Indium is present in the base metal ores at ppm levels. It first needs to be separated from the base ore and concentrated. This is done at the base metal smelter (for example during the refining of zinc, lead, copper, tin etc). It is then further refined and purified at indium refineries.


Question
:  Indium Tin Oxide (ITO) is the one of largest indium-containing products today.  How much of the indium mined goes to making ITO?

Claire:   About 50% of the indium refined is used for making ITO. A larger percentage is needed to start the ITO target productions but the sputtering process used (when putting the ITO layer onto the glass) is inefficient and generates a large quantity of indium which is reclaimed and is then recycled and put back into circulation.

Question:     Is there enough indium available to meet the current and future needs of the marketplace?

Claire:   The indium production has always expanded to meet growing demand. Indium production grew from 70MT (metric tonnes/year to over 500MT/year over the last 20 years. At the moment only one-third of the indium mined yearly is being refined in indium metal, another third accumulates in residues that are more expensive to treat but they remain available for future processing, and the last third is currently lost because it does not reach a base metal smelter which has the equipment to separate it from the base metal ore. Investments at these smelters would enable the extraction and refining of these quantities if the need arose.


Question:
    Are there recycling programs in place to recover unused ITO from the targets used to deposit it onto the glass surfaces where it is used?  What is the rate of recovery?

Claire:   There is ample capacity to treat spent ITO targets (as per point 3) and the recovery process is now mature and very efficient. The cycle time of this process has also now become very short enabling a very quick return of the refined indium for new consumption.

Question:    Are there any viable alternatives to ITO?

Claire:   A far as we know ITO remains the best material for LCD and other flat panel displays applications. It offers the best performances in terms of optical transparency, electrical resistivity, uniformity of both transparency and resistivity, chemical and mechanical stability, resistance to corrosion, and, finally, uniformity of etching.

The cost of the ITO on 42” TV represents less than $2 and less than 1% of the display cost. It is a small cost to pay to ensure that the quality of the display is maintained. Alternative materials have shown significant process problems with resistivity, uniformity and chemical and mechanical stability.

 


For more information:
www.indium.com/supply.php
http://en.wikipedia.org/wiki/indium

Indium 101 - Sealing

Wednesday, May 5, 2010 by Carol Gowans [Carol Gowans]
Indium BondingThe week before Mothers Day...an excellent time to talk about bonding!

Indium metal really shines when it comes to bonding a wide variety of surfaces together. 

Indium has several characteristics that make it an excellent candidate to bond or seal both metals and non-metals.
  • It stays pliable at cryogenic (-150C) temperatures.  This means that indium seals that are exposed to these cold temperatures will not crack or fail like other metals will.
  • Indium is great for bonding non-metallics such as glass, quartz and certain ceramics.
  • Since metals expand at different rates, this mismatch can cause a bond to break during heating and cooling.  Indium compensates for these differences.
  • Indium cold welds to itself so you can apply an indium coating to two surfaces like glass, quartz or certain ceramics that cannot be soldered and cold weld them together.
So if you have a hermetic sealing requirement or you are just looking to join two dissimilar metals together, take a look at indium. It might be the answer!