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Time Required for Refrigerated Flux and Solder Paste to Reach Room Temperature

Posted by Brandon Judd on Friday, December 21, 2012

One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use it?”

It is indeed very important for solder pastes and fluxes to be at ambient temperature (approximately 23oC) in order for them to exhibit optimal performance, as the rheology of these materials will differ in a refrigerated state. Additionally, "cool" materials condense atmospheric moisture onto their surfaces (like a glass of cold water in the humid summer air). This condensed moisture is an unwanted ingredient in high quality soldering.

In order to quantify the amount of time necessary for these materials to reach room temperature, we refrigerated both solder paste and flux in 6oz cartridges.  We then recorded the time it took to reach room temperature by placing thermocouple leads in the center of the materials through small holes that were drilled in the containers.

The following is a graph of the time versus temperature of warming both paste and flux:

For the testing above, the ambient temperature was approximately 22-24oC.  The flux required approximately 2.5 hours to reach room temperature, whereas the solder paste required approximately 2 hours.  It would be expected that the solder paste would reach room temperature faster than flux alone, as the metal content of the paste increases the thermal conductivity of the material. 

Of course, your particular conditions (refrigerator temperature, container size and shape, ambient temperature, etc.) will make your situation somewhat different.

For questions regarding the proper handling and storage procedures for solder materials, please contact Askus@indium.com.

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Variables in the Package-on-Package Process

Posted by Brandon Judd on Monday, December 17, 2012

When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful.  While the chemistry of your PoP dipping flux or paste plays a major role in PoP assembly, there is also much to consider in terms of the components, equipment, and reflow parameters being utilized. 

In order to help illustrate these variables, I have created the following Ishikawa diagram:

While I’m sure there are some variables that I have missed, these are the main ones to consider. 

For help deciding which products are right for your PoP process or help troubleshooting your current process, please contact AskUs@indium.com.

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Solder Paste/Preform Bond Line Thickness

Posted by Brandon Judd on Wednesday, September 5, 2012

Solder bondline joint indium corporationWhen helping customers with the optimization of their soldering process, the question often comes up;

“What will my solder bond line thickness be when utilizing this material?” 

The amount of volume lost to flux content while utilizing a solder paste, in comparison to a flux-coated preform, is much greater.  Whereas a flux-coated preform only contains about 1-2% flux by weight, a stencil printing solder paste is approximately 10% flux by weight.   This may not sound like much, but when you consider the density of the powdered alloy in the solder paste (7.40 g/cm3 for SAC305) versus the density of the flux (~1 g/cm3), you end up with a material that is almost 50% flux by volume! 

Therefore, if you were to print a 0.5” x 0.25” deposit utilizing a 0.005” thick stencil (0.001in3 of printed solder paste volume), you would only end up with approximately 0.0005in3 of actual metal solder.  In short, your final bond line thickness will be half of the thickness of the solder paste printed.

For help determining your bond line thickness, or for help determining the appropriate solder material for your application, please contact AskUs@indium.com.

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