Bonding Ribbon

Readers have asked how to visually assess a tabbing ribbon interconnection after a bond test.

This image is a cell that has been bond tested after soldering.

The first indication that you have a good bond is the physical resistance during the bond test. Even if you are peeling the ribbon off by hand, you will still notice if the ribbon jerks as it tears away from the cell. Fluctuation of bond strength may be caused by insufficient or inconsistent tabbing parameters, incomplete fluxing, or even contamination on the tabbing ribbon. If the resistance varies rapidly across the length of the bond, there could be an issue with microcracks. Microcracking of the underlying silicon is usually caused by built-up CTE (Coefficient of Thermal Expansion) stresses from tabbing. The ideal bond will peel apart where the tabbing ribbon meets the metallization, and it will be uniform. It should look like the image seen here.

There are some things you can do before, during, and after tabbing to get a better looking, and higher reliability, tabbing bond.

Before

Consider using alternative tabbing alloys and fluxes. Using Bi-based alloys at lower temperatures will lower the stresses caused by CTE mismatch and help eliminate microcracking. Softer tabbing ribbon can help keep stresses to a minimum as well.

During

Cell tabbing/stringing machines have many adjustable parameters. You owe it to your customers to explore the effects of parameter changes so you know you are building the best modules possible. (If I have time I’ll probably come to your facility to help – all you have to do is ask.)

After

Not everyone has time to wait, but if you have the luxury to let the tabbed cells sit for a day you should notice much better test results. Stresses built up in the silicon are partially relieved after 24-48 hours, which will result in less microcracking.

Let me know if I can help you make some beautiful cell interconnections!

~Jim (jhisert@indium.com)

After the report by Isofoton regarding reliability testing of Bi-based alloys for tabbing ribbon, the world learned that Bi-based alloys could survive the lamination process and function in use. If you haven’t seen it yet, I consider this mandatory reading! Here is the info: B. Lalaguna, P.Sanchez-Friera, I.J. Bennett, L.J. Caballero, J. Alonso, “Evaluation of Bismuth-Based Solder Alloys for Low-Stress Interconnection of Industrial Crystalline Silicon PV Cells", 22^nd EU PVSEC, Milan, 2007Milan, 2007.

We all know the Bi based alloys like 57Bi/42Sn/1Ag and 58Bi/42Sn can be used in a standard module assembly process, but is there an advantage to using Bi/Sn or Bi/Sn/Ag when Sn/Pb and Sn/Pb/Ag alloys are so well known and trusted in the industry?

I’ll give you 3 benefits:

1)    1) Bi/Sn/Ag and Bi/Sn are Pb-Free

2)    2) Bi/Sn/Ag and Bi/Sn are low-temperature alloys, they allow you to lower your tabbing process temperatures

3)    3) When paired with the correct flux and metallization, these Bi alloys form a powerful bond without microcracks (due to the lower process temperature)

Below are results with SunTab^TM ribbon assembled on a Komax X series stringer and tested on a XYZTEC Condor 150-3 bond tester (provided by the respective companies).

You’ll probably notice the lack of y-axis scale – I’m not going to give away all the cool information that easily! Contact me at jhisert@indium.com to learn more.

At the time of writing, the price of silver (Ag) was approaching the USD$50/tr.oz. (Troy ounce) level, and threatening to go higher. With 1 Troy ounce being 31.1grams, this makes the cost of pure silver ingot close to USD$1.60/gram.

Image from goldsilveroz.com

Materials costs are therefore a major consideration for anyone using silver in any form. Naturally, we are now seeing a few Power Semiconductor packaging houses evaluating the possibility of moving away from silver-filled epoxies for die-attach. The alternatives they are considering include the adoption of solder paste (or solder in some other form: wire / ribbon / preforms) versus a silver-filled epoxy.

Here are some thoughts on the Power Semiconductor assembly pros and cons, based on using solder paste as an alternative to silver-filled epoxies.

Good news (+)

+   Reduced materials costs
+   Improved pot-life / shelf-life *
+   Improved high temperature thermal-cycling
+   Strong, metallurgical joint formed between leadframe (substrate) / joining material / die
+   Improved thermal conductivity
+   Faster throughput (more units per hour, UPH)**
+   Easy clean-up ***
+   Does not wick onto NiPd surface to cause poor wire bondability

 * Although it is true that solder pastes are stored under refrigerated conditions, they do not require the -40C storage that is typical of silver-filled epoxies. 

 ** The dispense of solder paste is very rapid and can be done using multi-dot dispense heads. It undergoes rapid temperature reflow, versus the slow cure needed for metal-filled epoxies, which can be up to typically 1-3 hours, depending on the volume of silver epoxy.

 *** Because the solder paste flux does not cure like a polymeric material,  tubing and other conduits for the solder paste are easily cleaned out using common solvents, or can be simply purged with flux.


  ==================

Bad news (-)

-   Capital costs #
-   Adoption time / new process learning ##
-   Needs a solderable die surface
-   Voiding increase ####

 # The main cost-drivers here are:

- Reflow: Specialty reflow equipment is required for high temperature solders, such as
Heller or BTU reflow ovens

- Cleaning: If wirebonding is required after the reflow process, standard cleaning equipment and cleaning chemistry (aqueous or solvent-based) will be needed to remove flux residues

- Gas: Forming gas (H2/N2) or simple nitrogen may be needed to assist reflow.

Note that increasingly, for clip-bonding (non-wirebonding) applications using the new ultralow residue solder paste Indium9.32, even cleaning may not be needed, as the residue has been found to be compatible with compatible with a number of molding compounds in the industry.

 ## By partnering with a company like Indium Corporation with many years of experience in die-attach soldering, the ramp-up time can be significantly reduced.

 ### A solderable surface is usually a sequence of Ti / Ni / (Ag or Au) plated layers. The thickness of the silver (Ag) or gold (Au) precious metal layer is usually limited to 100nm (0.1microns). Compare this to a standard silver-epoxy bond line thickness (BLT) of 0.5-2mils (12-50microns).

 #### Acceptable voiding of less than 5% of the total die area is fairly easily achieved with good quality substrates and die-finishes.

  ==================

In closing, I am indebted to my friend and colleague Sehar Samiappan (Indium Corporation Area Technical Manager - South East Asia) for his insights.

Contact me to discuss this further.

Cheers!   Andy

I’ve been told that sometimes a good headline will include two things that seem to disagree. Using that logic, I’d say “cell interconnection” and “standardization” make a good headline, since there is no unified standardization in the tabbing and stringing process.

My new friends (pictured at right) hope to help change that. Dirk Schade and Cynthia Blank from XYZTEC have agreed to help Indium Corporation and the IPC Solar committee work toward building a standard for tabbing ribbon-to-cell bond strength testing.

XYZTEC is known for their high precision test equipment, which was developed for the semiconductor industry. They have since modified their equipment to handle c-Si cells, and to test the interconnection as well as the mechanical strength of the cells. Check it out here. 

Is there a cell/flux/ribbon/equipment combination that you would like to understand better? Maybe we could test your application!

Since I couldn’t find a good beginners guide to c-Si metallization paste, (not even from Wikipedia) I thought I’d provide an explanation of this important module assembly material:

The silicon solar cell has a low-temperature glass-frit paste applied to the active surface. This combination of glass, Ag, and other binder materials is printed onto the solar cell and fired around 850-1000degC to form the solderable metallization on the cell. This glass-silver mixture recombines during the firing process to break through the passivation/antireflective coating layer on the cell and form a strong bond to the cell. During firing the glass and silver are suspended in a mixture with silver forming an electrically conductive path from the top to the bottom of the deposit – and ideally a silver-rich layer is formed on top. This silver is the surface that tabbing ribbon is soldered onto when interconnecting cells.

Because the structure of the glass-silver is formed in the firing process, the firing can impact the solderability of the final metallization. That is the reason it is so important to determine the bond strength and diffusion/intermetallic formation of the interface between the cell metallization and tabbing ribbon solder coating.

Now here’s my challenge to you:

If you know of another good description, post a link to the document in the comments field below!

Thanks,

          ~Jim H.

Okay, I have a confession to make: I’ve always had a grudge against bismuth, ever since I started recommending thermal interface materials. It is the polar opposite of my favorite element (indium) – well, as much as a metal can be. These 2 elements (indium or bismuth) are added to almost every solder with a lower solidus temperature than Sn/Pb. The choice for most thermal interface applications that I have dealt with was indium or an indium alloy, but now I am starting to become very fond of my new friend bismuth for solar applications.

Bi/Sn and Bi/Sn/Ag are now available as a solderable coating for our Tabbing and Bus Ribbon. After getting a feel for this material, I must say I find it pretty nice to work with. Both alloys melt at 138-139degC, with the Bi/Sn/Ag having a greater tensile strength (which is not necessarily a good thing for tabbing ribbon). With a little bit of lab time I have isolated an existing flux that works very well with these alloys. So far GS-5454 has formed good solder bonds down to 160degC. This is great news, because it allows you to minimize the reflow temperature (and stresses) of your C-Si/tabbing ribbon interface. 

~Jim

X-section of tabbing ribbon showing solder thickness

Solder thickness is important whether you are interested in tabbing ribbon, bus ribbon, or (most likely) both types of PV interconnect materials. In almost all tabbing/stringing applications, the solder coating on the interconnect ribbon provides 100% of the solder used to form a metallurgical bond on top of solar cells.  With this in mind, the solder coating should be more than just a 'shiny finish' on the tabbing ribbon – but what is the proper thickness for soldering?

Indium Corp. has been making precision solder coated ribbon for quite a long time (and not just for tabbing/stringing).  This experience has taught us how to control solder thickness, and also what thicknesses work in various applications.  If you would like to learn how solder coating thickness affects the reliability of your solar cell, email us at: solar@indium.com.

Indium Corporation Fluxes

Solder fluxes facilitate solder wetting by dissolving the oxides present on the surface of the tabbing ribbon as well as the silver metallization bonding stripes on the top and bottom of the solar cell.  Typically liquid fluxes consist of a chemical activator package, rosin or a synthetic resin and a solvent system.

The solar industry has historically used fluxes formulated with alcohol solvents, but newer formulations are available formulated with low VOC solvents.  These newer low VOC fluxes are safer to use and have less environmental impact.

In both electronics assembly and the manufacture of solar cells, long term reliability is of paramount importance, and care must be taken to insure that the flux selected for soldering will be non-corrosive.   It is important the activator/resin system be designed to volatize or decompose during the peak temperature of soldering.  This insures that no corrosive by-products remain, and therefore the flux residue can safely remain on the substrate.  Such fluxes are known as "no-clean" and the formulation technology and reliability testing were developed for electronics assembly and microelectronics applications by flux manufacturers serving these industries.  In these industries, circuitry line width and spacing are significantly less than used in solar cells and even minute amounts of corrosive residues negatively impact on SIR (surface insulation resistance) performance.   Therefore it is prudent for the module assembler to select a tabbing ribbon flux supplier that also supplies to the electronics assembly and microelectronics industry.

Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But when we stopped to think about the way our customers were using them, we realized the most important part was the ENGINEERING part. Companies call us with a problem and we help them ENGINEER a solution by creating a specific shape of solder (preform) or a length of solder (ribbon or wire) that will help them.

So as another outlet to reach people with soldering questions, we will be using this blog to address the latest topics in electronics, medical, aerospace, defense and other markets that rely on soldering and bonding for their products.

The team that will be contributing to this blog has nearly 60 years of combined experience with these products, so we hope it will be useful to you. We hope you enjoy the blog and we look forward to your feedback!